ATS-12A-50-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-12A-50-C3-R0-ND

Manufacturer Part#:

ATS-12A-50-C3-R0

Price: $ 3.54
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X15MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12A-50-C3-R0 datasheetATS-12A-50-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.22182
30 +: $ 3.13467
50 +: $ 2.96050
100 +: $ 2.78630
250 +: $ 2.61218
500 +: $ 2.52510
1000 +: $ 2.26388
Stock 1000Can Ship Immediately
$ 3.54
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 19.22°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are a common component used in many types of electronic equipment, from consumer electronics, automotive and industrial applications, to telecom, medical and semiconductor equipment. Heat sinks are used to dissipate the heat from the components, such as transistors, resistors, and capacitors, in the system. The ATS-12A-50-C3-R0 is one of the most popular thermal heat sinks available on the market. It is designed to dissipate heat quickly and efficiently in order to protect and lengthen the life of sensitive components.

The ATS-12A-50-C3-R0 thermal heat sink is constructed from extruded aluminum and is designed for use in wide range of applications; including, but not limited to, semiconductors, processors, storage devices, consumer electronics, and automotive electronics. The extruded aluminum construction provides excellent thermal transfer properties and promotes efficient heat dissipation, allowing the components to operate at their optimal temperature. It is equipped with a unique 3D cooling fin architecture that actively dissipates the heat away from the components, keeping them cool and preventing overheating. The ATS-12A-50-C3-R0 heat sink also includes mounting screws and pre-installed thermal adhesive pads for easy installation.

The thermal performance of the ATS-12A-50-C3-R0 heat sink meets the industry standard of 50 watts/°C. The thermal resistance is 0.17°C/W, meaning the temperature will drop by 0.17°C for every watt of thermal power dissipated. This allows the components to maintain optimal temperatures and operate at a fraction of the temperature of standard aluminum heat sinks. Additionally, the ATS-12A-50-C3-R0 heat sink features a wide profile and large surface area, both of which assist in maximizing the thermal performance.

The ATS-12A-50-C3-R0 is a highly effective and reliable thermal heat sink solution. It is designed to provide efficient and reliable thermal management for a wide range of applications. The unique 3D cooling fin architecture actively dissipates heat from the components, while the advanced aluminum construction ensures superior thermal transfer properties. The wide profile and mounting options make the ATS-12A-50-C3-R0 a great choice for any system. With its excellent thermal performance and reliable construction, the ATS-12A-50-C3-R0 is the perfect solution for any application that requires a reliable thermal heat sink.

The specific data is subject to PDF, and the above content is for reference

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