| Allicdata Part #: | ATS-12A-51-C3-R0-ND |
| Manufacturer Part#: |
ATS-12A-51-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12A-51-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-12A-51-C3-R0 is a thermal-heat sink designed to effectively dissipate heat from an electronic device to maintain optimal operating temperature. It is a type of heat sink that is either passive (no fans or active cooling) or active (utilizing fans) to cool components.
Design
The design of the ATS-12A-51-C3-R0 is simple yet effective. It is made up of a series of thin metal plates mounted together on a base. These metal plates have fins, or small ridges, that extend from the base. These fins increase the surface area of the plate and allow air to circulate more easily as it passes through the fins. This airflow helps to dissipate the heat away from the device more quickly.
Material
The ATS-12A-51-C3-R0 is made from aluminum alloy, which is known for its ability to conduct heat and for its durability. Aluminum is lightweight and can support a lot of weight without bending, making it an ideal material for thermal-heat sinks. It is also inexpensive and easy to machine, which makes it well-suited to manufacturing and assembly.
Application Field
The ATS-12A-51-C3-R0 can be used to dissipate heat from a variety of electronic components, such as processors, controllers, memory chips, and other parts that generate excessive heat during operation. It is also ideal for cooling of Raspberry Pi, Arduino, and other small computing device.
Working Principle
The ATS-12A-51-C3-R0 works in two ways: convection and conduction. Convection is the process of transferring heat through the air. As warm air passes through the fins, it transfers its heat to the metal plates, which then dissipate the heat away from the device. This is why the fins are important, as they increase the surface area for the air to pass through.
Conduction is the process of directly transferring heat through metal. The metal plates conduct the heat from the device to the fins, which then dissipate the heat away from the device. This helps to quickly reduce the temperature of the device, allowing it to operate efficiently.
Conclusion
The ATS-12A-51-C3-R0 is an effective thermal heat sink designed to efficiently dissipate heat from various electronic devices. Its aluminum alloy construction is lightweight, durable, and inexpensive, making it ideal for a variety of applications. Its thermal transfer design works via convection and conduction for efficient cooling. This makes the ATS-12A-51-C3-R0 an excellent option for cooling a variety of electronic components.
The specific data is subject to PDF, and the above content is for reference