ATS-12A-55-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	24.11°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-12A-55-C3-R0 Application Field and Working Principle

Heat sinks, sometimes referred to as heat-dissipation components, are devices used to transfer thermal energy, typically generated by electrical current, from one part of a system to another. ATS-12A-55-C3-R0 is one of the most popular components under heat sinks. This article will discuss its application field and working principle in detail.

Application Field

ATS-12A-55-C3-R0 can be used in a wide range of applications. Specifically, it is commonly used in the telecommunications and computing industries for low-power electronic devices. For example, ATS-12A-55-C3-R0 is often used in cell phones, laptop computers, and other electronic devices that require heat dissipation.In addition, ATS-12A-55-C3-R0 can also be used in medical and industrial applications such as medical imaging devices, industrial lasers, and instrumentation equipment. Furthermore, it can be applied in automotive, energy, and military industries. For instance, it is often used in electric vehicles, solar energy systems, and military applications such as radar systems.

Working Principle

Heat sinks, including ATS-12A-55-C3-R0, work by allowing thermal energy to be transferred from an object with a higher temperature to one with a lower temperature. The thermal conductivity of heat sinks, in combination with physical contact between the sink and the hot object, ensure efficient thermal transfer.Specifically, ATS-12A-55-C3-R0 dissipates heat by convection. When a hot object is placed on the heat sink, heat from the object is transferred to surrounding air. The heat is then spread away from the object by convection, allowing a gradual cooling of the object. This process increases the efficiency of the electronic device that the heat sink is used for.To maximize its efficacy, ATS-12A-55-C3-R0 features an internal structure called a fin. The fin is a flat, curved surface made of metal and connected to other metal components of the heat sink. This structure ensures maximum absorption of heat from the hot object. Furthermore, it increases the surface area in contact with the surrounding air, allowing for greater convection.In addition, ATS-12A-55-C3-R0 is designed with a surface material that is highly thermally conductive. The high thermal conductivity of the material helps to absorb and transfer more heat from the hot object quickly and efficiently.

Conclusion

In conclusion, ATS-12A-55-C3-R0 is one of the most popular components under heat sinks due to its wide range of applications. The device works by allowing thermal energy to be transferred from an object with a higher temperature to one with a lower temperature. ATS-12A-55-C3-R0 features an internal fin structure and a highly thermally conductive surface material, which allow for maximum absorption and dissipation of heat from the hot object.

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