| Allicdata Part #: | ATS20260-ND |
| Manufacturer Part#: |
ATS-12A-97-C2-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12A-97-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.93750 |
| 10 +: | $ 3.82851 |
| 25 +: | $ 3.61595 |
| 50 +: | $ 3.40326 |
| 100 +: | $ 3.19051 |
| 250 +: | $ 2.97781 |
| 500 +: | $ 2.76511 |
| 1000 +: | $ 2.71193 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-12A-97-C2-R0 Thermal - Heat Sinks
Thermal - Heat Sinks are an essential component of any electronic component, playing an important role in the dissipation and protection of heat from the device. Thermal - Heat Sinks are utilized to move heat away from sensitive areas of the device, allowing the device to work at an optimal temperature and preventing it from becoming too hot and damaging itself.
ATS-12A-97-C2-R0 Thermal - Heat Sinks are designed to mount over the critical area of a device, providing additional cooling surface for heat removal. These types of heat sinks are typically constructed of aluminum or copper and have fins that are folded and spaced evenly. Additionally, the ATS-12A-97-C2-R0 can be mounted in several locations, depending on the device and space constraints.
The ATS-12A-97-C2-R0 Thermal - Heat Sinks feature a universal mounting structure and a direct cooling path, allowing the heat sink to quickly move heat out of the device where it can be dissipated. The cooling fins are spaced at a uniform density throughout the surface area of the heat sink, ensuring even heat dissipation and providing a high-performance cooling solution. Additionally, the ATS-12A-97-C2-R0 features a flat-base design, allowing for easy mounting and removal.
The ATS-12A-97-C2-R0 also features a patented heat transfer system that utilizes a thermally conductive, non-toxic, non-flammable fluid to move the heat away from the critical device area. This fluid helps to minimize hot spots and improves overall device performance. Additionally, the ATS-12A-97-C2-R0 is designed with a positive air pressure system that helps to prevent contamination of the fluid.
The ATS-12A-97-C2-R0 is designed for maximum effectiveness and durability. The heat sink is constructed of high-grade materials, including aluminum and copper, and is designed for a lifetime of use. The fins are corrosion-resistant and feature a high thermal conductivity for improved performance. Additionally, the ATS-12A-97-C2-R0 is designed with a unique surface finish to ensure a superior fit.
The ATS-12A-97-C2-R0 Thermal - Heat Sinks are an ideal solution for applications requiring high-efficiency cooling. The universal mounting design, direct cooling path, and innovative heat transfer technology make the ATS-12A-97-C2-R0 an ideal solution for dissipating heat from electronic devices. The corrosion-resistant fins and superior fit combine to provide a reliable, high-performance solution that can withstand the rigors of long-term use.
The specific data is subject to PDF, and the above content is for reference