| Allicdata Part #: | ATS-12B-01-C3-R0-ND |
| Manufacturer Part#: |
ATS-12B-01-C3-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12B-01-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an integral part of any microelectronic system and efficient cooling is essential to both improve device performance and ensure longevity. One of the most important cooling solutions used in a microelectronic system is the heat sink. Heat sinks are designed to dissipate heat from components and dissipate it into the ambient air. They are typically composed of two parts, a base and a finned structure, which works together to provide effective thermal performance.
The ATS-12B-01-C3-R0 heat sink is designed to dissipate moderate levels of heat from CPUs and other dissipating components. It is constructed from aluminum alloy and is equipped with a finned structure that is effective for heat dissipation. The finned design of the ATS-12B-01-C3-R0 ensures maximum thermal performance, allowing it to properly manage temperatures of up to 160°C. Additionally, this heat sink has an accuracy of ±2°C which makes it suitable for use in temperature-critical applications.
The ATS-12B-01-C3-R0’s primary application field is in cooling components in consumer electronics products such as home appliances and audio equipment. Additionally, it can often be found in computing and office equipment, network infrastructure, medical electronics systems, and automotive electronics components.
In terms of working principle, the ATS-12B-01-C3-R0 is designed to absorb and dissipate heat from dissipating components in electronics systems. It does this by taking in the ambient air and the heat produced by the components, and conduction the heat to the fins through the aluminum base. By absorbing and exchanging the heat, the heat sink is able to lower the temperature of the component and prevent overheating.
The ATS-12B-01-C3-R0 also features a unique grille design that allows it to passively move large quantities of air over its finned surface. This ensures that the heat sink is able to transfer more heat away from the component. The grille also improves the overall efficiency of the heat sink, as more heat can be dissipated with a lower fan speed, enabling the device to remain quiet and consume fewer power.
The ATS-12B-01-C3-R0 heat sink is an effective and efficient solution for eliminating excess heat from components in a variety of applications. Its finned design makes it ideal for applications that require maximum thermal performance, while its grille design ensures that it is able to move large quantities of air and effectively dissipate heat. As such, the ATS-12B-01-C3-R0 is an ideal choice for any thermal management solution.
The specific data is subject to PDF, and the above content is for reference