ATS-12B-10-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-12B-10-C1-R0-ND

Manufacturer Part#:

ATS-12B-10-C1-R0

Price: $ 3.61
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12B-10-C1-R0 datasheetATS-12B-10-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.28104
30 +: $ 3.19242
50 +: $ 3.01505
100 +: $ 2.83771
250 +: $ 2.66036
500 +: $ 2.57169
1000 +: $ 2.30565
Stock 1000Can Ship Immediately
$ 3.61
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.87°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal solutions are necessary components for electronic devices to remain operational. The ATS-12B-10-C1-R0 heat sink is a great example of a high-performing thermal solution. It is an active heat sink designed for air cooled applications, providing continuous cooling. It provides excellent heat dissipation and efficient heat transfer, allowing it to be used in a variety of situations.

The ATS-12B-10-C1-R0 heat sink is designed to provide maximum efficiency for applications that require continuous cooling. Its design combines active cooling, thermal bridging, and convective cooling technologies, ensuring effectiveness. Its configuration allows for more efficient heat dissipation from the heat source to the ambient environment.

The ATS-12B-10-C1-R0 heat sink has a series of fins that allow air to pass through them and cool the chip. As air passes through the fins, it cools the heat sink and disperses heat to the ambient environment. This increase in airflow allows for more efficient cooling and improved heat dissipation. The fins are also designed to optimize air velocity and maximize the cooling effect.

The ATS-12B-10-C1-R0 heat sink also has a thermal bridge linking the heat source to the heat sink. This bridge acts as a conduit, allowing heat to travel from the heat source to the heat sink. By providing a pathway for the heat to travel, the thermal bridge ensures that the heat can be efficiently dissipated. The design of the bridge also allows for air to flow to the heat sink more evenly, enabling it to properly and quickly dissipate the heat.

The ATS-12B-10-C1-R0 heat sink also utilizes a convection-based cooling system. By using convective cooling, heat is directed away from the heat source, dissipating into the ambient environment. This cooling system is highly efficient, allowing it to effectively transfer and dissipate heat from the heat source. The convective cooling system also helps to improve air flow, allowing for improved cooling.

The ATS-12B-10-C1-R0 heat sink is a great choice for applications that need continuous cooling. Its combination of active cooling, thermal bridging, and convective cooling technologies allows it to effectively dissipate and transfer heat, delivering the best performance. It is designed for high performance applications, providing unparalleled cooling performance.

The specific data is subject to PDF, and the above content is for reference

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