ATS-12B-103-C3-R1

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.374" (9.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	27.78°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

A thermal heat sink, or simply heatsink, is a device made of metal that is designed to dissipate heat away from a hot object, such as a computer processor or power component. It is usually used in combination with a fan to further improve its cooling efficiency. The ATS-12B-103-C3-R1 is a specialized heat sink designed for thermal management applications in many applications. In this article we will look at its application fields and working principle.

Applications Field

The ATS-12B-103-C3-R1 could be used in many application fields, including:

• Telecommunication: critical components, such as power supplies, transceivers and multiplexers, require passive cooling solutions, which the heat sink offers.
• Computer and Electronics: In many multi-core processors and advanced GPUs, proper cooling solutions are required to maintain a high operating temperature. The ATS-12B-103-C3-R1 often provides the necessary thermal dissipation.
• Industrial Design: The heat sink can be used in a variety of industrial applications, including chemical and electrical engineering, for its reliable thermal performances.
• Automotive: The ATS-12B-103-C3-R1 can be used in high-performance automotive applications, such as engine control systems.

Working Principle

The ATS-12B-103-C3-R1 utilizes the principle of forced convection cooling. Forced convection involves the movement of air over the surface of a heat sink, which causes turbulent air flow that aids in thermal dissipation. The heat generated by the object to be cooled is transferred to the heat sink surface, where it is quickly dissipated. This continuous process enables the heat sink to maintain its operating temperature.The ATS-12B-103-C3-R1 is made of an aluminum extruded fin section and is designed to maximize the surface area. Its fin design ensures a large surface area, which improves cooling performance. The heat sink is also designed with a "T" profile, which increases its structural rigidity and helps to dissipate heat more efficiently.The ATS-12B-103-C3-R1 is also equipped with through holes and is designed to fit many different applications. Through-holes help to maintain a secure fit between the heatsink and the object to be cooled, ensuring that the thermal connection remains tight.

Conclusion

The ATS-12B-103-C3-R1 is a specialized heatsink designed for thermal management applications. Its wide range of application fields and the use of advanced fin design make it an ideal choice for efficient cooling in many applications. Its efficient thermal dissipation capabilities make it an attractive option for any application requiring high-performance cooling solutions.

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