| Allicdata Part #: | ATS-12B-129-C1-R0-ND |
| Manufacturer Part#: |
ATS-12B-129-C1-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12B-129-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49335 |
| 30 +: | $ 3.29910 |
| 50 +: | $ 3.10502 |
| 100 +: | $ 2.91098 |
| 250 +: | $ 2.71691 |
| 500 +: | $ 2.52285 |
| 1000 +: | $ 2.47433 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.64°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an essential component of any electronic circuit or device; they help ensure the reliability and accuracy of the device or system. ATS-12B-129-C1-R0 is an innovative new thermal management solution specifically designed for internal or external enclosures with one or more integrated circuit cards. By providing exceptional thermal performance, the ATS-12B-129-C1-R0 helps to maximize device, system, and enclosure reliability and accuracy.
The ATS-12B-129-C1-R0 is a dual-function device. It is designed to manage heat by dissipating it away from critical components, while also simultaneously providing electromagnetic interference (EMI) shielding. The ATS-12B-129-C1-R0 combines both heat sink and EMI shield functions by integrating an array of aluminum fins into a pre-formed, aluminum extrusion box.
The aluminum extrusion box is composed of custom-designed, die-cast aluminum pre-formed sections. It is designed to fit snugly around all internal components of the system and includes cutouts for mounting screws, vents, and other features. Its aluminum fins are designed to evenly distribute heat away from components while its EMI shield acts as a barrier against interference from external sources. Additionally, the extrusion box allows for easy air flow and ventilation.
The ATS-12B-129-C1-R0 is designed to optimize thermal performance in a wide range of applications. Its aluminum fins are optimized to enable high-efficiency thermal dissipation from internal components, with a maximum heat dissipation of 4 Watts/degrees Celsius (deg. Celsius). It also offers excellent EMI shielding, with a shielding effectiveness of up to 70 dB for a 10 MHz frequency range. Additionally, the ATS-12B-129-C1-R0’s aluminum fins are designed to divert heat away from critical components, while its pre-formed aluminum extrusion box reduces design time and costs.
The ATS-12B-129-C1-R0 thermal heat sink’s design, materials, and construction make it an ideal choice for a variety of applications. ATS-12B-129-C1-R0 are used in consumer electronics, medical devices, industrial control systems, military and aerospace electronics, automotive electronics, and other applications. They offer superior thermal performance and high reliability in a wide range of temperature and humidity environments.
The ATS-12B-129-C1-R0 is designed to provide high-efficiency thermal management performance and electromagnetic interference (EMI) shielding. Its aluminum fins offer efficient thermal dissipation and EMI shielding, while its pre-formed aluminum extrusion box helps to reduce design time and costs. This advanced thermal heat sink solution is suitable for a variety of applications, from consumer electronics to aerospace electronics, and offers exceptional thermal and EMI performance.
The specific data is subject to PDF, and the above content is for reference