| Allicdata Part #: | ATS20307-ND |
| Manufacturer Part#: |
ATS-12B-131-C2-R0 |
| Price: | $ 5.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12B-131-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.05260 |
| 10 +: | $ 4.91589 |
| 25 +: | $ 4.64285 |
| 50 +: | $ 4.36968 |
| 100 +: | $ 4.09658 |
| 250 +: | $ 3.82347 |
| 500 +: | $ 3.55036 |
| 1000 +: | $ 3.48209 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical component of many computer, industrial, and telecommunication systems. Heat sinks are important devices in thermal management as they dissipate heat generated by electronic components and can help extend the working life of those components. ATS-12B-131-C2-R0 is a heat sink that offers users an effective way to manage the heat generated by components inside their systems. This article will discuss the application field and working principle of ATS-12B-131-C2-R0.
ATS-12B-131-C2-R0 is a compact, low-profile heat sink that can provide up to 16 watts of cooling capacity. It is ideal for applications where space is at a premium, such as embedded systems or high-density enclosures. The heat sink measures just 3.8 x 3.6 x 1.5 inches and weighs less than 5 ounces, yet it is capable of dissipating enough heat to keep components running at optimum temperatures. The heat sink is designed to be used in conjunction with a fan, and it can support a variety of fans.
The ATS-12B-131-C2-R0\'s application field is diverse. It is suitable for use in a wide range of computer systems, such as desktop PCs, laptops, servers, and workstations. It can also be used in industrial systems, such as medical imaging equipment, robots, and laboratory instruments. In telecommunications, the ATS-12B-131-C2-R0 can be used to help cool the transceivers, routers, base stations, power amplifiers, and other components in networks.
The working principle of ATS-12B-131-C2-R0 is based on natural convection and forced convection. Natural convection occurs when warm air rises and cooler air falls, creating a circulation of air. Forced convection is a type of active convection in which a fan is used to create a flow of air around the heat sink. This airflow transports heated air away from the heat sink and dissipates it in the surroundings. The ATS-12B-131-C2-R0 has a hollow central core which helps to increase air flow, resulting in greater heat dissipation.
ATS-12B-131-C2-R0 is an effective heat sink for a wide range of applications. It can provide up to 16 watts of cooling capacity and is designed for use with a fan. Its application field is diverse, including computers, industrial systems, and telecommunications. It works using a combination of natural convection and forced convection, with a hollow central core to increase airflow and heat dissipation.
The specific data is subject to PDF, and the above content is for reference