| Allicdata Part #: | ATS20316-ND |
| Manufacturer Part#: |
ATS-12B-14-C2-R0 |
| Price: | $ 4.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12B-14-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.95640 |
| 10 +: | $ 3.85182 |
| 25 +: | $ 3.63787 |
| 50 +: | $ 3.42380 |
| 100 +: | $ 3.20979 |
| 250 +: | $ 2.99580 |
| 500 +: | $ 2.78181 |
| 1000 +: | $ 2.72832 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal solutions such as Natural convection and conduction are typically used to cool electronics components such as CPUs, GPU, and FPGAs. Heat sinks are also commonly used to dissipate heat from components. The ATS-12B-14-C2-R0 is a special type of heat sink designed for limited space applications.
The ATS-12B-14-C2-R0 is a small, single-slot, thermally efficient heat sink. It is designed to fit into tight areas and provide maximum thermal cooling performance. The ATS-12B-14-C2-R0 features a finned aluminum construction with integrated thermal pads to ensure maximum thermal performance. The heat sink is designed with a low profile and its fins are oriented horizontally to make best use of available air flow. Additionally, the heat sink is designed to be used with forced air cooling systems to increase its thermal performance even further.
The ATS-12B-14-C2-R0 is typically used in electronics such as single board computers, embedded control systems, digital signal processors, and other devices in small form factors. These devices are typically required to operate under high loads and elevated temperatures. Heat sinks such as the ATS-12B-14-C2-R0 are used to dissipate the heat generated by the components, thus preventing damage to the device.
The ATS-12B-14-C2-R0 works by promoting natural convection of air to cool the device. The aluminum fins on the heat sink absorb heat from the surface of the device, and the air flowing over the fins dissipates the heat away from the device. Additionally, the thermal pads used in the construction of the heat sink provide better thermal contact between the device and the heat sink, thus providing more efficient cooling.
Overall, the ATS-12B-14-C2-R0 is an effective heat sink solution for limited space applications. It provides a high level of thermal cooling performance, and its low profile design allows it to be used in areas where other heat sink solutions may not be viable. The ATS-12B-14-C2-R0 is an ideal choice for applications where space is at a premium and the cooling of electronic components is critical.
The specific data is subject to PDF, and the above content is for reference