| Allicdata Part #: | ATS20319-ND |
| Manufacturer Part#: |
ATS-12B-142-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12B-142-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal dissipation is an important element of many modern machines, components and systems. Heat from dissipated energy must be removed quickly and efficiently to ensure effective operation of the system. Heat sinks, such as the ATS-12B-142-C2-R0, are frequently used for this purpose. In this article, we will discuss the application field and working principle of ATS-12B-142-C2-R0 thermal - heat sink.
ATS-12B-142-C2-R0 is a high-performance, low-profile heat sinks, and it is widely used in industrial, military and aerospace electronic equipment. This heat sink is designed with the latest anodic oxide coating technology, which can provide superior performance in wide temperature range. In addition, the low-profile base of the ATS-12B-142-C2-R0 ensures minimum interference in the system while maximising the thermal performance.
The ATS-12B-142-C2-R0 thermal - heat sink is designed to dissipate heat efficiently by maximizing the surface area and utilizing the natural convection and conduction of air. This heat sink is composed of a base plate, a fin stack and a fan. The base plate is made of a high strength aluminum alloy, which can absorb and redistribute the heat from the component to the fin stack. The fin stack is composed of a series of thick, spaced fins, which provide an increased surface area for thermal dissipation. The fan is designed to increase the convection of air, which is more efficient than convection alone. The combined effect of this design ensures that the heat is quickly and efficiently dispersed, keeping the hardware cool and preventing performance degradation.
The ATS-12B-142-C2-R0 thermal - heat sink is perfectly suitable for high-power applications and is ideal for use in precision machinery, consumer electronics, military systems, medical devices and industrial control applications. It is also compatible with an extensive range of processor and memory chips. With a low acoustic noise level, the performance of the ATS-12B-142-C2-R0 can be optimized for quiet operation, making it the perfect choice for small and medium-sized applications.
In conclusion, the ATS-12B-142-C2-R0 thermal - heat sink is a highly efficient, low profile heat sink that can be used in a variety of applications. Its unique design ensures fast and efficient thermal dissipation, while its versatile mounting options make it suitable for a wide range of applications. With its superior performance and versatility, the ATS-12B-142-C2-R0 is an ideal choice for electronic designers.
The specific data is subject to PDF, and the above content is for reference