ATS-12B-150-C2-R0

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Thermal - Heat Sinks are specialized devices used to efficiently dissipate heat away from a component or system. Today’s devices often require cooling solutions to reduce the device heat found during normal operation, especially in high-performance and mission-critical applications. Simultaneously, the need for increasingly more compact devices and systems has increased the need for increased levels of thermal management and cooling system performance and performance-to-size ratio. ATS-12B-150-C2-R0 is an example of an ultra-high performance and versatile air-cooled heat sink.

The ATS-12B-150-C2-R0 features a fin pattern with multidirectional air flow and airflow resistance values up to 17 CFM. This allows for efficient thermal dissipation and higher than standard levels of cooling performance. The combination of this performance along with low airflow restrictions makes it an ideal choice for applications where cooling needs to be done quickly and effectively.

The ATS-12B-150-C2-R0 uses an optimized fin pattern which maintains uniform air flow while simultaneously creating a static pressure drop. This ensures a high flow rate and a low static pressure, which reduces fan noise and power consumption. Additionally, the air is directed through the fins evenly, which helps to ensure uniform thermal distribution. This distribution also minimizes the risk of component overheating.

In addition to the superior design of the fins in the ATS-12B-150-C2-R0, the heat sink also features an innovative copper base plate. This copper base plate helps to further increase the heat transfer performance of the heat sink by eliminating any thermal gaps between the base plate and the component being cooled. This ensures maximum thermal performance at minimal risk of component damage.

The ATS-12B-150-C2-R0 is designed to be used in a wide variety of applications, including server racks, embedded system boards, graphics processor units, and high-performance computers. Due to its ability to dissipate heat quickly and efficiently, it is also suitable for applications that require reliable long-term operation. It ensures not only maximum performance but also the reliability and durability of the associated components.

Thermal management and cooling solutions, such as the ATS-12B-150-C2-R0, are becoming increasingly important as devices and systems become more compact and require higher levels of cooling performance. The ATS-12B-150-C2-R0 is an example of an air-cooled, ultra-high performance heat sink that uses an optimized fin pattern, copper base plate, and low airflow restrictions to maximize cooling performance for reliable, long-term operation. By utilizing this heat sink, businesses can rest assured that their devices and systems will remain cool and efficient with minimal risk of component damage or overheating.

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