ATS-12B-166-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.12°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal-Heat Sinks and the ATS-12B-166-C1-R0Thermal-Heat Sinks are an important component of any electronic device or appliance. It is essential for dissipating heat generated from electronic components, as the heat must be removed in order to safeguard the electronics and provide a safe, reliable operation. A thermal-heat sink is a device that uses a combination of thermally conductive materials and air currents to remove heat from components or systems.The ATS-12B-166-C1-R0 is a thermal-heat sink designed to dissipate the heat generated by the components while maintaining the efficiency of the system. The aluminum-clad design acts as a radiator, transferring heat away from the heat source and allowing the components to stay cool. The heat sink also features a ventilation system to reduce the static pressure inside the casing, thus allowing air to flow freely and cooling the overheating parts efficiently.The ATS-12B-166-C1-R0 can be used in several applications, including servers, data centers, computer systems, gaming systems, and consumer electronics. In servers, data centers, and computer systems, it is used to ensure the temperature remains below the threshold to avoid overworking the processor or other components. In gaming systems, it is used to reduce noise levels and prevent overheating of the GPU or other components in order to maintain the optimal performance. In consumer electronics applications, it is used to prevent thermal damage and maintain the longevity of the electronics.The working principle of the ATS-12B-166-C1-R0 is based on the principle of thermodynamics. The heat generated by the electronics is transferred away from its component and dissipated into the air or water around it. The aluminum-clad design acts as a heat dissipation surface for the heat to be removed from the systems. Furthermore, the ventilation system ensures the system remains cool by preventing the static pressure from building up inside the casing.The ATS-12B-166-C1-R0 also includes a number of additional features. It features a patented jet impingement effect which helps to lower the temperature of the heat sink by creating small air currents. It also has a nickel-plated copper base which improves the thermal transfer and adds durability and strength. The aluminum-clad design also helps to improve the overall thermal performance of the system.In conclusion, the ATS-12B-166-C1-R0 is an ideal thermal-heat sink for providing efficient cooling for components and systems in various applications. It is designed to provide maximum heat dissipation while keeping the system cool and efficient. Its aluminum-clad design and patented jet impingement effect provide superior thermal performance and durability. Furthermore, its ventilation system helps to reduce the static pressure inside the casing, thus allowing air to flow freely and cooling the overheating parts efficiently.

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