| Allicdata Part #: | ATS-12B-170-C3-R0-ND |
| Manufacturer Part#: |
ATS-12B-170-C3-R0 |
| Price: | $ 3.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12B-170-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are thermal management components or devices which transfer, absorb, and dissipate heat generated by other components in an electronic system. There are a variety of heat sink designs to suit different application parameters. Among them, the most commonly used is the ATS-12B-170-C3-R0 thermal heat sink.
ATS-12B-170-C3-R0 is a type of aluminum extruded U-channel finned heat sinks. It is designed to actively dissipate heat from other components in a system. Its fins are constructed of .125" thick 6061-T6 aluminum which provides excellent thermal conductivity. The U-channel design also features a 3-inch base width and a 4-inch fin height. This provides an efficient and effective way to dissipate thermal energy.
How does an ATS-12B-170-C3-R0 thermal heat sink actually work? As the heat from the component reaches it, the heat sink absorbs the heat through its extruded aluminum fins. The aluminum fins are of a high-grade material which has excellent thermal conductivity properties. The absorbed heat is then transferred to the surrounding air through convection. As the air passes through the heat sink’s fins, the heat it had absorbed from the target component is dissipated into the air. This continuous process helps to keep the component and the system as a whole cool and operating at safe temperatures.
The ATS-12B-170-C3-R0 is available in a large selection of sizes and configurations to suit most application needs. It is also highly customizable with its open U-channel design which can be cut and attached to other components. The device is also UL listed and FCC certified, making it suitable for a variety of applications such as industrial machinery, consumer electronics, and medical instruments.
As a result of its efficient design and high quality construction, the ATS-12B-170-C3-R0 thermal heat sink has become the most widely used thermal management component in the electronics industry. Its reliability, performance, and ease of installation make it the ideal choice for cost-efficient thermal management solutions.
The specific data is subject to PDF, and the above content is for reference