ATS-12B-23-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-12B-23-C3-R0-ND

Manufacturer Part#:

ATS-12B-23-C3-R0

Price: $ 5.12
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X15MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12B-23-C3-R0 datasheetATS-12B-23-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.60341
30 +: $ 4.34784
50 +: $ 4.09210
100 +: $ 3.83632
250 +: $ 3.58057
500 +: $ 3.32481
1000 +: $ 3.26087
Stock 1000Can Ship Immediately
$ 5.12
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.06°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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A thermal heat sink is an essential component in many electronic devices to ensure proper heating of the electronics, as well as preventing the equipment from overheating and failing to function properly. One of the most commonly used types of thermal heat sinks is the ATS-12B-23-C3-R0, which is designed to provide efficient cooling even in the most challenging settings. In this article, we will look more closely at this particular component and examine its application field and working principles.

Application Field

The ATS-12B-23-C3-R0 thermal heat sink is designed primarily for use in the industrial sector where high levels of heat and/or air flow are often required. Its large surface area makes it ideal for providing efficient cooling in high-temperature and/or air movements in large devices. It is also well suited for use in military equipment, as its robust construction can withstand the rigorous conditions of harsh environments. Furthermore, due to its relatively small size and footprint, it can be used in applications where space is limited. It is a suitable choice for both industrial and consumer electronics, as it is especially designed for long-term use.

Working Principle

The ATS-12B-23-C3-R0 thermal heat sink utilizes a thermoelectric heat sink technology to achieve efficient cooling. This technology works by transferring heat from the component or system to a cooling element, such as a metal plate with many small fins. This heat transfer is enabled by the use of a thermoelectric Peltier element, which works by creating a power differential between two points on the semiconductor. It is then able to transfer the heat from one point to the other, dissipating it through the specialized cooling fins. This technology is particularly effective and is known to achieve rapid heat dissipation under many operating conditions.

In addition to the use of a Peltier element, the ATS-12B-23-C3-R0 thermal heat sink also utilizes a closed-cavity fanless design. This means that the system is sealed, allowing it to operate without any airflow or cooling fans, resulting in a quieter operation. This is also beneficial, as the sealed nature of this system prevents any dust or dirt from entering and compromising the cooling performance.

Conclusion

The ATS-12B-23-C3-R0 thermal heat sink is a highly efficient cooling solution, particularly for industrial applications. Its Peltier element coupled with a closed-cavity fanless design produces excellent cooling performance and is suitable for a wide range of conditions. Furthermore, its footprint and construction make it an appealing option for situations where space is limited and robust construction is desired. In summary, the ATS-12B-23-C3-R0 thermal heat sink is an ideal choice for the industrial sector and many other challenging settings.

The specific data is subject to PDF, and the above content is for reference

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