| Allicdata Part #: | ATS-37944-ND |
| Manufacturer Part#: |
ATS-12B-33-C2-R0 |
| Price: | $ 6.14 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X17.78MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12B-33-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.52510 |
| 10 +: | $ 5.37831 |
| 25 +: | $ 5.07982 |
| 50 +: | $ 4.78094 |
| 100 +: | $ 4.48213 |
| 250 +: | $ 4.18333 |
| 500 +: | $ 3.88452 |
| 1000 +: | $ 3.80982 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are devices used to transfer, separate, and dissipate heat to keep electronic components cool. The ATS-12B-33-C2-R0 is a type of thermal heat sink used to cool high-power, high-density electronics. This specific thermal heat sink has features such as wide-wing length, cut outs for air flow, and even an integrated locking system.
The wide-wing length of the ATS-12B-33-C2-R0 thermal heat sink allows for better air flow, which ensures effective thermal conductivity and heat dissipation. Additionally, this thermal heat sink includes cut-outs for air flow, which increase the air flow rate and provide better airflow distribution. This helps ensure optimal cooling and temperature regulation. Lastly, the ATS-12B-33-C2-R0 has an integrated locking system that helps to secure the heat sink onto a computer.
The ATS-12B-33-C2-R0 thermal heat sink is ideal for use in high-power, high-density electronics, such as graphics cards, hard drives, and gaming consoles. Its wide-wing length provides better air flow, while its integrated locking system helps to ensure that it remains securely attached to the electronic device. Additionally, the cut-outs for air flow further help to improve the thermal conductivity and heat dissipation of the device.
One of the main advantages of the ATS-12B-33-C2-R0 is its ability to dissipate heat quickly and efficiently. It does this by using its wide-wing length to allow for better air flow and cooling, and its integrated locking system helps to keep it secure. Additionally, the cut-outs for air flow increase the air flow rate and provide more efficient heat dissipation. The thermal heat sink is also very durable, so it can withstand the constant heat produced by high-power electronics.
In summary, the ATS-12B-33-C2-R0 is a thermal heat sink designed to dissipate heat quickly and efficiently from high-power electronic components. It features a wide-wing length for better air flow, cut-outs for air flow, and an integrated locking system to ensure secure attachment. The thermal heat sink is perfect for use in graphics cards, hard drives, and gaming consoles, and is highly durable, giving it the ability to withstand the intense heat generated by these components.
The specific data is subject to PDF, and the above content is for reference