| Allicdata Part #: | ATS-12B-35-C1-R0-ND |
| Manufacturer Part#: |
ATS-12B-35-C1-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X5.84MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12B-35-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are devices used to remove unwanted heat from an electronic component. The ATS-12B-35-C1-R0 heat sink is a type of heat sink designed to provide improved thermal management for a variety of electronic components. This article will explore the application field and working principle of theAATS-12B-35-C1-R0 heat sink.
Application Field of the ATS-12B-35-C1-R0 Heat Sink
The ATS-12B-35-C1-R0 heat sink is a specialized thermal management device designed for use in high powered applications. It can handle a maximum temperature of up to 350°C and can dissipate more than 40W of heat. It is highly suited to applications that require a great deal of thermal management, such as high power LED lighting applications, high power RF amplifiers, and high power laser modules. It is also ideal for applications that require high-power but low-noise operation, such as cooling fans in computers and home audio systems.
Working Principle of the ATS-12B-35-C1-R0 Heat Sink
The ATS-12B-35-C1-R0 heat sink consists of a series of interconnected aluminum fins that are arranged in a circular shape to provide a large surface area for heat dissipation. The fins are held in place by a mounting clip that attaches to the electronic component. Heat from the component is transferred to the surface area of the fins, which then dissipate the heat into the surrounding environment. The aluminum fins also provide a low thermal resistance, allowing the heat to be dissipated quickly and efficiently.
The ATS-12B-35-C1-R0 heat sink is also designed to have an extremely low noise output due to its special construction. The fins are all connected using insulated mounts, thus reducing the resonance frequency, which helps to reduce the amount of noise generated by the device. Furthermore, the airflow over the aluminum fins is optimized to reduce turbulence and improve cooling performance. As a result, the ATS-12B-35-C1-R0 heat sink provides excellent thermal management with low noise output.
Conclusion
The ATS-12B-35-C1-R0 heat sink is a specialized thermal management device designed for use in high powered applications that require a great deal of thermal management. It is capable of dissipating up to 40W of heat and can handle a maximum temperature of up to 350°C. Its aluminum fins provide a large surface area for heat dissipation while its special construction allows it to operate with an extremely low noise output. Therefore, the ATS-12B-35-C1-R0 heat sink is the ideal choice for applications that require improved thermal management without generating excessive noise.
The specific data is subject to PDF, and the above content is for reference