ATS-12B-38-C2-R0 Fans, Thermal Management |
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| Allicdata Part #: | ATS-12B-38-C2-R0-ND |
| Manufacturer Part#: |
ATS-12B-38-C2-R0 |
| Price: | $ 6.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X22.86MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12B-38-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.52888 |
| 30 +: | $ 5.22186 |
| 50 +: | $ 4.91463 |
| 100 +: | $ 4.60744 |
| 250 +: | $ 4.30028 |
| 500 +: | $ 3.99312 |
| 1000 +: | $ 3.91632 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are components that can be attached to electronic devices to help dissipate heat generated as a byproduct of the device’s operation. This heat must be controlled by effective and efficient heat dissipation to ensure the device continues to operate without sustaining any damage. The ATS-12B-38-C2-R0 is a special type of heat sink that has many applications and relies upon specific working principles.
The ATS-12B-38-C2-R0 is a thermal – heat sink that is designed to dissipate heat from an embedded device or component. It is a convection-based type of heat sink that makes use of fins, or small protrusions, to increase the amount of surface area that is in contact with the ambient air. The fins allow air to constantly flow across the sides of the heat sink, which helps to create a constant cooling effect as the heat is dissipated from the heat sink and into the environment.
The ATS-12B-38-C2-R0 heat sink has many applications within the electronics industry. They are often used to dissipate heat from circuit boards, processors, and other embedded electronic components. Heat sinks of this kind are also useful for controlling the environment inside a computer cabinet or rack server, as they can be used to draw warm air away from the components and dissipate it to keep the components running at optimal temperatures.
The working principle of the ATS-12B-38-C2-R0 heat sink is simple. It relies on the process of convection to transfer the heat from the embedded component to the air, thus avoiding any damaging overheating. As air passes across the finned sides of the heat sink, the heat is dissipated into the environment, keeping the device cool and free from heat damage. This process is also aided by the physical size of the heat sink, which helps to increase the surface area that can make contact with the air.
In addition, the convection process creates a situation in which a low-pressure environment is created to one side of the heat sink, which causes air to flow through the fins and draw heat away from the embedded component. This allows the heat sink to effectively regulate the temperature of the component, while also providing efficient cooling.
The ATS-12B-38-C2-R0 heat sink is an effective and efficient solution for keeping embedded devices and components cool. Its design and working principle make it ideal for a wide variety of applications, from computer cabinets and servers to circuit boards and processors. By relying upon convection to dissipate heat, heat sinks of this type provide reliable cooling without causing damage to the components.
The specific data is subject to PDF, and the above content is for reference