| Allicdata Part #: | ATS-12B-41-C1-R0-ND |
| Manufacturer Part#: |
ATS-12B-41-C1-R0 |
| Price: | $ 6.18 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X17.78MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12B-41-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.56353 |
| 30 +: | $ 5.25462 |
| 50 +: | $ 4.94550 |
| 100 +: | $ 4.63636 |
| 250 +: | $ 4.32727 |
| 500 +: | $ 4.01818 |
| 1000 +: | $ 3.94091 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.02°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is the practice of managing excessive heat within a system. Many electronic systems generate heat as a byproduct of operation, as do many industrial machines. In order to remain efficient and functional, many systems need to be cooled to an acceptable temperature. The ATS-12B-41-C1-R0 heat sink is one of the technologies available to help do this.
The ATS-12B-41-C1-R0 is a heat sink designed for specific applications. It is a fairly small heat sink, measuring 12 millimeters by 41 millimeters, with a cylinder-shaped body made from aluminum. The body is coated with a substance called thermoconductive epoxy, which increases its ability to dissipate heat.
The primary application for an ATS-12B-41-C1-R0 heat sink is in thermal systems containing surface mount devices, such as chips and diodes. These devices often generate a great deal of heat, so they require additional cooling, or thermal management, to remain operational. An ATS-12B-41-C1-R0 heat sink can be used to cool these devices, and prevent them from overclocking, or running at too high of a temperature.
The working principle of an ATS-12B-41-C1-R0 heat sink is relatively simple. Heat generated by the device is transferred to the heat sink body due to the thermoconductive epoxy coating. The aluminum then radiates the heat away from the device, dissipating it into the surrounding environment. This heat dissipation reduces the temperature of the device, which prevents it from becoming overloaded or damaged by the heat.
Apart from thermal systems, ATS-12B-41-C1-R0 heat sinks can also be used in other areas where thermal management is necessary. They can be found in consumer electronics, such as laptops, video game consoles, and computers. They are also used in industrial components, such as engines, motors, and turbines. The heat sink can be used in almost any system where heat management is required, as long as it is the right size and shape for the application.
While the ATS-12B-41-C1-R0 heat sink may seem like a small component, its small size belies its importance. Proper thermal management is essential to ensuring the long-term performance and reliability of electronic and industrial systems. The ATS-12B-41-C1-R0 heat sink is one of the most versatile and reliable solutions available for managing excess heat, and is an invaluable tool for any thermal management system.
The specific data is subject to PDF, and the above content is for reference