| Allicdata Part #: | ATS-12B-45-C1-R0-ND |
| Manufacturer Part#: |
ATS-12B-45-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12B-45-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are essential elements of various machineries, equipment and systems. The ATS-12B-45-C1-R0 Thermal Heat Sink is an innovative and efficient solution for thermal management systems.
The ATS-12B-45-C1-R0 is a Finned Thermoelectric Heat Sink with a 45mm base size and dual layout. It features a combination of both a Mica-Ceramic Heat Spreader and a Nickel-Plated Copper Fin Heat Sink. It has a thermal resistance of 0.6°C/W and a thermal impedance range of 0.5-0.7°C/W. It is RoHS compliant and designed with an optimized heat dissipation performance in mind.
The ATS-12B-45-C1-R0 can be applied in a variety of fields, including power supplies, telecommunications, machine vision, motion control and gaming systems. It is suitable for both indoor and outdoor environments, and its built-in protective performance ensures high reliability and safety.
The ATS-12B-45-C1-R0 Thermal Heat Sink has several working principles that allow it to effectively dissipate heat from electrical and electronic components. First, the fin heat sink is designed to absorb and transfer heat away from the IC or other components of the system. Next, the Mica-Ceramic Heat Spreader generates an air gap between the heat sink and the components. This allows the fin heat sink to absorb more of the heat from the components, thus providing better cooling performance. Finally, the Nickel-Plated Copper Fins are designed to increase the efficiency of heat transfer from the heat sink to the ambient environment.
The ATS-12B-45-C1-R0 Thermal Heat Sink is an optimal solution for many applications in the field of thermal management. Its combination of reliable thermal performance and lightweight construction makes it an ideal choice for use in a variety of industries. Its simple installation and large fin area make it easy to incorporate into existing systems, making it a great addition to modern machinery and equipment.
The specific data is subject to PDF, and the above content is for reference