| Allicdata Part #: | ATS20427-ND |
| Manufacturer Part#: |
ATS-12B-66-C2-R0 |
| Price: | $ 4.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12B-66-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.51710 |
| 10 +: | $ 4.39551 |
| 25 +: | $ 4.15120 |
| 50 +: | $ 3.90701 |
| 100 +: | $ 3.66282 |
| 250 +: | $ 3.41863 |
| 500 +: | $ 3.17444 |
| 1000 +: | $ 3.11340 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The thermal-heat sink ATS-12B-66-C2-R0 has many applications and a unique working principle. Its thermal-heat sink design allows it to be used in heat-sensitive electronic components and has become a prevalent choice among the engineering community today.
AE&TS-12B-66-C2-R0 provides a relatively efficient way of dissipating and controlling heat generated from electronic components. In particular, its compact size allows it to be used with much larger printed circuit boards. This makes it suitable for a wide range of applications, from thermal control of small integrated circuits to cooling large server chipsets.
Unlike traditional cooling methods such as fan cooling, thermal-heat sink ATS-12B-66-C2-R0 works on the principle of thermal-compression transfer. This involves the transfer of heat from the component through a heat-conducting surface between two working fluids, such as air or water. Thermal compression transfer can be used to dissipate heat more effectively compared to fan-cooling, with fewer moving parts.
The ATS-12B-66-C2-R0 variety of thermal-heat sink is especially designed for commercial and industrial applications. It has a low profile and can dissipate heat from components in confined spaces. The heat sink\'s aluminum base has a pressure equalizing feature to ensure an even spread of heat.
The ATS-12B-66-C2-R0 supports most standard components, including high-power memory chips, logic chips, digital signal processors, and processors. It also provides heat dissipation for many high-power audio components, such as amplifiers and preamps.
The ATS-12B-66-C2-R0 is reliable and durable. Its robust design ensures high-performance heat dissipation over a long period of time with minimal maintenance. Its superior thermal transfer characteristic, along with its excellent mechanical properties, make it a highly efficient heat transfer solution.
Thermal-heat sink ATS-12B-66-C2-R0 is designed to meet the requirements of both industrial and consumer-level applications. Its versatility makes it an attractive choice for both niche and mainstream product applications. It can be used in a variety of applications, including gaming consoles, personal computers, server platforms, telecommunication devices, and automotive control systems.
The ATS-12B-66-C2-R0 has a variety of features, including optimized heat transfer rate, low-profile design, and an easy to fit profile. It also has a highly efficient cooling system, and a low-profile aluminum base. Additionally, its fanless design and quiet operation make it an ideal cooling solution for noise-sensitive areas, such as offices and homes.
In conclusion, the ATS-12B-66-C2-R0 is a reliable and efficient thermal-heat sink designed for many applications. Its low-profile design, highly efficient cooling system, and reliable mechanical properties make it a highly effective heat transfer solution. It is an attractive solution for a range of consumer and industrial applications, and can be used in a variety of applications, including gaming consoles, personal computers, server platforms, telecommunication devices, and automotive control systems.
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