ATS-12B-70-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.69°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction: Heat sinks are essential components used in electronic systems to dissipate heat from hot sources and help to maintain the temperature of the system within the operational limits. Heat sinks are a simple and efficient solution to thermal management and are widely found in most consumer electronic products, industrial equipment, and computer systems.The ATS-12B-70-C1-R0 is a heat sink designed for a wide range of applications, from processor cooling to CPU and GPU fans, as well as many other consumer and small-scale industrial applications. This heat sink has evolved from a simple aluminum or copper plate with fins to a highly-constructed and complex product. ATS-12B-70-C1-R0 is an ideal choice for thermal management in many applications.Application Field and Working Principle: The ATS-12B-70-C1-R0 heat sink is composed of an aluminum base and heat conductive fins that are designed to optimize heat dissipation and improve the performance of the electronic system. The aluminum base is connected to the fins (or heat spreaders) via extrusion process to provide fast cooling. Fin geometry is optimized to maximize surface area for maximum heat dissipation. The fins can be lined up horizontally or vertically depending on the shape and size of the system. The vertically arranged fin structure increases the effective surface area to further improve cooling efficiency.The ATS-12B-70-C1-R0 heat sink works by absorbing heat from the components and dissipating it to the surrounding environment. Heat is transferred from the system\'s components to the heat sink by conduction and then to the outside air by convection. Due to its high heat-dissipating capacity, this heat sink is able to extract and dissipate heat quickly, thus keeping the system temperature within the optimal range.The ATS-12B-70-C1-R0 heat sink is ideal for a wide range of electronic systems, including personal computers, server systems, networking equipment, and audio-video devices. The heat sink\'s performance is further enhanced with the addition of a fan, which provides additional cooling by creating airflow over the surface of the heat sink. The fan\'s speed can be adjusted depending on the system\'s requirements, allowing for more control and customization.Advantages: The ATS-12B-70-C1-R0 heat sink is an ideal choice for thermal management in a variety of applications. It offers improved cooling performance due to the high-efficiency fin structure and the extruded aluminum construction. The fins are spaced in such a way that optimizes heat dissipation, thereby ensuring the system stays within optimal temperature ranges. This heat sink is also extremely cost-effective and easy to install, making it a popular choice for many electronic systems.The addition of a fan further increases the cooling performance of the heat sink, helping to keep the system temperature within its optimal range. The fan\'s speed can be adjusted based on the system\'s requirements, making it an ideal choice for monitoring the system\'s temperature.Conclusion:In conclusion, the ATS-12B-70-C1-R0 heat sink is an efficient solution for thermal management in many applications. It offers improved cooling performance due to its high-efficiency fin structure and aluminum construction. The fan further increases the cooling performance and can be adjusted based on the system\'s requirements. The ATS-12B-70-C1-R0 heat sink is an ideal choice for most consumer electronic products, industrial equipment, and computer systems.

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