| Allicdata Part #: | ATS-12B-75-C1-R0-ND |
| Manufacturer Part#: |
ATS-12B-75-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12B-75-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.Thermal heat sinks are one of the most commonly used components in the modern commercial/industrial sector. They are used to dissipate heat generated by electronic devices and help keep devices from over-heating. The ATS-12B-75-C1-R0 is a powerful thermal heat sink designed to dissipate large amounts of heat with minimal noise and maximum efficiency.
The ATS-12B-75-C1-R0 utilizes a micro-channel design to maximize heat dissipation. The ATS-12B-75-C1-R0 is constructed with aluminum alloy and utilizes a copper-based joint plate to attach to the component or device which generates heat. The heat sink is composed of discrete slats which contain multiple micro-channel paths along the length of each slat. This allows the heat generated to be dissipated rapidly.
The ATS-12B-75-C1-R0 is designed to have a low profile, creating less obstruction for connecting other components. This allows for increased airflow and more efficient heat dissipation. Additionally, the ATS-12B-75-C1-R0 features a self-adhesive backing which allows for increased efficient thermal absorption and maximum heat dissipation.
The working principle behind thermal heat sinks is fairly simple. Heat generated by the electronic device is absorbed by the heat sink and then dissipated into the environment. This process is accomplished by utilizing the properties of thermodynamics, specifically heat transfer. As the heat is absorbed, the temperature of the heat sink begins to rise and through the process of convection heat is dissipated from the heat sink. The rate at which heat is dissipated is dependant upon the material that the thermal sink is made from and the design of the sink.
The ATS-12B-75-C1-R0 is a powerful thermal heatsink which can dissipate large amounts of heat with minimal noise. Due to the dynamic design of the sink, the heat generated can be dissipated quickly and efficiently. This makes the ATS-12B-75-C1-R0 an ideal choice for applications that require large amounts of heat dissipation, such as high-powered electronics. The self-adhesive backing and low-profile design allows for easy integration and installation into any system.
The specific data is subject to PDF, and the above content is for reference