| Allicdata Part #: | ATS20437-ND |
| Manufacturer Part#: |
ATS-12B-76-C2-R0 |
| Price: | $ 3.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12B-76-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.30750 |
| 10 +: | $ 3.22182 |
| 25 +: | $ 3.13463 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.57°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are used to absorb, store, and dissipate heat generated by electronic devices and components. The ATS-12B-76-C2-R0 is a specifically designed heat sink from the company “Taiwan Energy Technology Inc.” It is designed for applications in a variety of industries including automotive, robot, telecom, LED lighting, and various other high-power electronics and components.
The ATS-12B-76-C2-R0 heat sink features a high aluminum extrusion ratio of 3.1mm aluminum surface to active area rate as well as an ultra-slim profile of up to 1.8mm to allow for easy and tight integration into medium power density applications. Furthermore, the heat sink features a unique fanless design with a large external fin area of 76mm x 36mm which is ideal for both medium-power density applications and applications with more limited space requirements.
In order to better understand the efficiency of the ATS-12B-76-C2-R0 heat sink, it is important to understand the heat sink’s working principle. The working principle of a heat sink involves the transfer of heat from a hot source, such as a processor or other electronic device, to a cooler medium. In the case of the ATS-12B-76-C2-R0 heat sink, the hot air or processor-generated heat is absorbed by the aluminum fins on the outside of the heat sink where it is then drawn away with a fan and released through the outside. This process ensures a steady rate of air exchange and is generally more efficient than the traditional air-cooled pop-up style heat sinks which circulate the air from inside the heat sink.
In addition to the traditional air-cooled heat sink design, the ATS-12B-76-C2-R0 heat sink employs the use of a highly efficient copper base plate with a black anodized aluminum top panel which is designed to ensure optimal heat transfer. The copper base plate serves to absorb the heat from the processor or other electronic components and transfer it to the aluminum fins on the outside of the heat sink. The aluminum fins then dissipate the heat into the air, ensuring maximum cooling efficiency.
The ATS-12B-76-C2-R0 heat sink is designed for use in a variety of applications such as automotive, robot, telecom, LED lighting and a variety of high-power electronics and components. This heat sink is ideal for medium power density applications due to its slim design, high aluminum extrusion ratio, and efficient copper base plate. As such, the ATS-12B-76-C2-R0 is the ideal choice for an efficient thermal solution.
The specific data is subject to PDF, and the above content is for reference