| Allicdata Part #: | ATS-12B-76-C3-R0-ND |
| Manufacturer Part#: |
ATS-12B-76-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12B-76-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Introduction
The Heat Sinks are widely used nowadays. Thermal management is a major issue in every electronic system, as it affects the reliability, performance and even the lifespan of devices. Thermal management is optimized using custom heat sinks. Heat sinks are among the most important components in any electronic systems and cooling engineering. One of the most used heat sinks is ATS-12B-76-C3-R0, which is a high-quality, cost-effective solution for higher power levels.
Application field
ATS-12B-76-C3-R0 is a great solution for applications that require higher power levels. It is especially suitable for dissipating high power dissipation in a wide range of industrial, medical, and communication products. This product is also suitable for cooling down hot spots which are usually caused by high current device packages such as CPUs and GPUs. Moreover, it is suitable for driving LEDs such as high-brilliant LEDs or white-emitting LED arrays. This product is also suitable for computers and gaming consoles, power supply and other electronic products.
Working principle
The working of ATS-12B-76-C3-R0 mainly depends on fin design and heat sink material. This product features a unique fin design to optimize heat transfer from components and circuit boards. The fins are all aluminum and are designed to maximize the contact area with air. With its surface treatment process, ATS-12B-76-C3-R0 does a great job of efficiently dissipating heat. In addition, its robust design with integrated screws helps further dissipate heat away from heat sources.
The heat sink is made of high-quality aluminum alloy, and is composed of three parts: the main body, the screw mount base and the heat dissipation fins. The main body includes two pieces of symmetrical disassembly, reusable bracket, and a base with provides superior conductivity. The screw mount base provides good connection between the heat sink and the circuit board. The heat dissipation fins allow heat to be transferred away quickly and efficiently from the heat source. The material is designed to have a high thermal conductivity and thermal stability in order to provide a reliable and long-lasting heat sink.
Conclusion
The ATS-12B-76-C3-R0 is an efficient and reliable thermal management solution for higher power levels and larger components. Its unique fin design and high-quality material ensure a great heat dissipation performance. It is suitable for a wide range of applications such as high power dissipation components, LED, computers, gaming consoles and other electronic products. The ATS-12B-76-C3-R0 is a great choice for thermal management in any electronic system.
The specific data is subject to PDF, and the above content is for reference