ATS-12C-02-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-12C-02-C3-R0-ND

Manufacturer Part#:

ATS-12C-02-C3-R0

Price: $ 3.60
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X12.7MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12C-02-C3-R0 datasheetATS-12C-02-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.26907
30 +: $ 3.18087
50 +: $ 3.00422
100 +: $ 2.82744
250 +: $ 2.65074
500 +: $ 2.56237
1000 +: $ 2.29730
Stock 1000Can Ship Immediately
$ 3.6
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.44°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management has become an increasingly important part of many modern electronic equipment. The development of high efficiency, high performance, and low-power electronic products has led to an increased demand for cooling solutions using thermal management techniques. Heat sinks are one of the main cooling elements, and one of the most popular types of thermal management products is the ATS-12C-02-C3-R0.

The ATS-12C-02-C3-R0 is a high-efficiency, high-performance, and low-power cooling solution. This thermal solution combines a highly efficient aluminum heat sink, with a state-of-the-art heatpipe construction. The ATS-12C-02-C3-R0 is capable of dissipating up to 200W of heat from a single heat source. This makes it ideal for applications where a single heat source needs to be cooled. It is also well suited for applications that require high performance and low-power cooling.

The ATS-12C-02-C3-R0 features a highly efficient design, which allows for better cooling performance than most other heat sinks. The construction also helps to provide a low-profile thermal solution, which is an important factor when trying to cool high performance components in tight spaces. The ATS-12C-02-C3-R0 also features an optimized cooling design, which allows it to be used in even the most challenging environments.

The ATS-12C-02-C3-R0 is specifically designed to be used in a variety of applications such as servers, computers, gaming consoles, and industrial equipment. It can be used to cool microprocessors, graphics cards, RAM modules, and other components that generate excessive heat. It is also ideal for electronics that require high performance and low-power cooling, such as industrial equipment, computers, servers, and gaming consoles.

The ATS-12C-02-C3-R0 has a highly efficient aluminum heat sink construction, which provides optimal cooling performance. It also features an innovative design, which helps to provide a low-profile thermal solution that is ideal for tight spaces. The construction also helps to provide an optimized cooling design, which ensures that the ATS-12C-02-C3-R0 can be used even in the most demanding environments.

The ATS-12C-02-C3-R0 is a high-performance and low-power thermal management solution that is ideal for cooling a variety of electronic devices. It is designed to dissipate up to 200W of heat from a single heat source, which makes it an ideal solution for applications where a single heat source needs to be cooled. It is also well suited for applications that require high performance and low-power cooling. Thanks to its innovative design, the ATS-12C-02-C3-R0 is an ideal choice for cooling a variety of electronic devices in tight spaces.

The specific data is subject to PDF, and the above content is for reference

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