
Allicdata Part #: | ATS-12C-06-C3-R0-ND |
Manufacturer Part#: |
ATS-12C-06-C3-R0 |
Price: | $ 3.65 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X10MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.31695 |
30 +: | $ 3.22707 |
50 +: | $ 3.04781 |
100 +: | $ 2.86858 |
250 +: | $ 2.68930 |
500 +: | $ 2.59965 |
1000 +: | $ 2.33071 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 20.27°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management solutions, such as the ATS-12C-06-C3-R0 heat sink, are an important part of any electronic system. These components are designed to provide efficient and increased performance, by allowing heat to be removed from the components to ensure safe operation. The ATS-12C-06-C3-R0 is specifically designed to provide a direct-mounted, low-profile heat sink for thermal management of electronics.
This heat sink has a unique design with a wide variety of sizes and shapes that make it suitable for many applications including electronic and semiconductor components, displays, and communication systems. Its low-profile design makes it an ideal solution for small spaces and its robust design makes it a great choice for industrial and other high temperature applications. The ATS-12C-06-C3-R0 heat sink is designed to provide efficient cooling and heat dissipation to help reduce the thermal load on the system.
The ATS-12C-06-C3-R0 heat sink has two main components that make up its design: the heat spreader and the fins. The heat spreader is a flat metal plate that serves as the primary heat transfer mechanism for the heat sink. This plate is made of a material with high thermal conductivity, such as copper or aluminum. The fins are attached to the heat spreader and act as additional heat transfer surfaces and serve to increase the surface area to improve heat dissipation. The fins are typically made of anodized aluminum for a durable finish and increased thermal performance.
The working principle behind the ATS-12C-06-C3-R0 heat sink is simple and effective. The heat spreader absorbs the heat from the components and transfers it to the fins, where it is dissipated away from the components. This helps reduce the temperature of the components, thus preventing them from overheating. The fins also help move the heat away from the components, which helps reduce the thermal load on the system.
The ATS-12C-06-C3-R0 heat sink is a great choice for a wide variety of applications. Its low-profile design makes it ideal for small spaces, and its robust design makes it a great choice for industrial and other high temperature applications. Its efficient cooling and heat dissipation helps to reduce the thermal load on the system and ensures safe operation of the components. The ATS-12C-06-C3-R0 heat sink is a reliable and cost-effective solution for thermal management.
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