ATS-12C-110-C2-R1 Allicdata Electronics
Allicdata Part #:

ATS20482-ND

Manufacturer Part#:

ATS-12C-110-C2-R1

Price: $ 5.59
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X40X12.7MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12C-110-C2-R1 datasheetATS-12C-110-C2-R1 Datasheet/PDF
Quantity: 1000
1 +: $ 5.07780
10 +: $ 4.93920
25 +: $ 4.66452
50 +: $ 4.39022
100 +: $ 4.11585
250 +: $ 3.84146
500 +: $ 3.56707
1000 +: $ 3.49848
Stock 1000Can Ship Immediately
$ 5.59
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.126" (54.01mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 26.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are important components used in the cooling of electronic components and systems. The ATS-12C-110-C2-R1 is a thermal heat sink which is specially designed for cooling electronic components and systems. It is used for various applications such as power supplies, processors, storage devices, and more.

The ATS-12C-110-C2-R1 is made from an aluminum alloy which is both strong and lightweight. It has a black anodized finish which is durable as well as attractive. The heat sink is designed in such a way that it can accommodate a variety of components and devices. It can be used to cool a variety of devices such as power supplies, processors, storage devices, and other components.

The ATS-12C-110-C2-R1 is designed so that it can efficiently dissipate heat from the components or device it is cooling. It has a conical shape which helps to ensure that the air travels through the fins of the heat sink and away from the components. The fins of the heat sink are closely spaced together to ensure that heat is spread evenly throughout the heat sink and dissipated away. The heat sink is also designed in such a way that it is able to dissipate more heat than traditional heat sinks.

The ATS-12C-110-C2-R1 also features an integrated fan which helps to increase air flow and further improve the efficiency of the heat sink. The fan is located directly behind the fins of the heat sink and helps to push air through the fins and away from the components. This helps to ensure that the heat is spread throughout the heat sink and efficiently dissipated away.

The ATS-12C-110-C2-R1 is a great choice for cooling various devices and components. It is designed to offer high performance in a small package and is a great choice for applications that require a reliable and efficient cooling solution. The ATS-12C-110-C2-R1 is a great choice for various applications such as power supplies, processors, storage devices, and other components.

The specific data is subject to PDF, and the above content is for reference

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