| Allicdata Part #: | ATS-12C-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-12C-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12C-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Thermal - Heat Sinks are specialized electronic components that allow for cooling of a component or device, through the transfer of thermal energy from one substance to another. Heat Sinks are used to reduce heat buildup in electronic components, such as processors, transistors, and other electrical components.
The ATS-12C-117-C1-R0 is a high performance thermal management component designed specifically for cooling electronic components. It utilizes a combination of aluminum and copper material to provide a stable and efficient heat dissipating solution. The ATS-12C-117-C1-R0 is capable of dissipating up to 100 Watts of power, while the aluminum alloy material maximize the thermal transfer capability.
The goal of the ATS-12C-117-C1-R0 is to reduce the amount of heat generated within a system, by providing a thermal conduction path to an alternate medium. To achieve this, the ATS-12C-117-C1-R0 utilizes the principle of thermal conductivity, which is the ability of a material to allow the transfer of energy in the form of heat. The construction of the heatsink normally consists of a base plate, a fin assembly, and heat sinks.
The base plate is typically made of aluminum or copper and works as an anchor for the heatsink. It is also used for mounting the heatsink to the components. The fin assembly is composed of extruded fins that are arranged in many layers. The fins are designed to allow air to pass freely between them, as the air has a higher thermal conductivity than the base material.
The heat sinks are designed to disperse the heat generated from the component directly to the environment. Heat sinks are typically made of aluminum alloy to maximize thermal transfer. Additionally, a thermal interface material (TIM) is used between the base and the heatsink to ensure a proper interface. The TIM provides a layer of insulation between the two materials and helps to fill any air gaps, which can severely limit the thermal transfer capabilities of the heatsink.
Overall, the ATS-12C-117-C1-R0 is designed to be a highly efficient thermal management solution for electronics. The combination of the aluminum and copper material allows for maximum thermal transfer capability. Additionally, the fin design and TIM ensure that heat is effectively dispersed to the environment.
The specific data is subject to PDF, and the above content is for reference