ATS-12C-12-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	15.93°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-12C-12-C3-R0 Thermal - Heat Sinks
Thermal - Heat Sinks are beneficial components in many electronic devices, since they help disperse the heat created by the device’s operation. The ATS-12C-12-C3-R0 Thermal heat sink is an all aluminium heat sink with a copper base plate and a fan attached. The product is mainly used in applications such as telecom, server, CPU cooler, high performance computers and other specialty component cooling. It has a wide range of application in both industrial and consumer electronics.

Application Field of ATS-12C-12-C3-R0 Thermal - Heat Sinks
The ATS-12C-12-C3-R0 Thermal - Heat Sinks is used in a wide range of applications in industries such as telecom, servers, high performance computers and consumer devices. Because of its superior performance, it is the preferred heat sink of choice for many manufacturers. For telecom applications, the ATS-12C-12-C3-R0 Thermal - Heat Sinks is used in situations where there is a need for high density cooling. It is ideal for cooling high power amplifiers and other equipment in telecom systems. In servers, the ATS-12C-12-C3-R0 Thermal - Heat Sinks is used to dissipate the heat generated by the high power processors to ensure optimum performance. It is also commonly used in high performance computers to ensure the necessary cooling for the high end components.

Working Principle of ATS-12C-12-C3-R0 Thermal - Heat Sinks
The ATS-12C-12-C3-R0 Thermal - Heat Sinks uses a combination of thermal materials and air flow to effectively dissipate heat from the device. The heat is absorbed by the thermal materials and then released into the surrounding air. The air flow created by the fan attached to the heat sink assists in cooling the device by circulating air around the device. The air also helps to increase the thermal mass of the heat sink by carrying the heat away from the device and into the environment. As the air passes through the heat sink, it is also cooled by the heat sink’s fins and the surrounding air. This process helps to keep the device cool and ensures its optimal performance.

Advanced Features of ATS-12C-12-C3-R0 Thermal - Heat Sinks
The ATS-12C-12-C3-R0 Thermal - Heat Sinks offers a number of advanced features that make it a superior choice for device cooling applications. The product features an advanced thermal conductive structure made of aluminum and copper material that increases the heat dissipation. The aluminum and copper materials help to dissipate the heat from the device and into the surrounding air more effectively. Additionally, the fan attached to the heat sink increases the air flow and helps to circulate air around the device. This increases the thermal mass of the heat sink as the air carries the heat away from the device. Other features of the product include mounting holes for easy installation, and an anodized surface finish that makes it resistant to corrosion.

Conclusion
The ATS-12C-12-C3-R0 Thermal - Heat Sinks is a superior cooling solution for many applications in both industrial and consumer electronics. Its advanced construction, featuring an aluminum base plate and a copper base, enhances the heat dissipation capabilities of the product and helps to cool the device more effectively. Additional features such as mounting holes and an anodized surface finish, improve the product\'s usability and make it more durable. The inclusion of a fan further increases the air flow to enhance the cooling capabilities of the product. Thanks to its superior performance, the ATS-12C-12-C3-R0 Thermal - Heat Sinks is the preferred choice of many electronics manufacturers.

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