ATS-12C-121-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.48°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

ATS-12C-121-C2-R0 is a thermal - heat sinks product used for cooling several electronics and electrical components. Heat sinks are made up of a base and a number of ribbed or curved fins mounted on top. These fins, made of a heat-conductive material such as copper, provide a larger surface area for heat to dissipate.

Application Fields

Heat sinks are widely used in the electronics industry as a way to reduce excess heat generated by the electronics components, such as processors. This thermal solution is particularly important for high power applications, including high power LED lighting, server and storage rack mounted devices, telecommunication equipment, and any other applications that require heat sinks to manage thermal energy generation. Heat sinks are also necessary for a variety of automotive applications ranging from engine cooling to motor power controllers. Additionally, thermal solutions such as ATS-12C-121-C2-R0 are used in consumer electronics, including cellular phones, gaming consoles, tablets, and other devices.

Working Principle

The working principle of the ATS-12C-121-C2-R0 thermal heat sink is based on a heat exchange process. Heat from the surrounding environment is released to the air through the heat sink fins. As the fins cool, the overall temperature of the device or component is reduced. This process works by transferring heat from the component to the fins through conduction. The heat is then dissipated into the surrounding environment, allowing the device or component to cool.The fins are typically made from a material with high thermal conductivity. Copper is the most common fin material, but aluminum is also sometimes used. The material affects the rate at which heat is transferred from the device or component to the air. A thicker, higher-conductivity material will be more effective than a thinner, lower-conductivity material.The geometry of the fins also affects the cooling rate. A larger surface area has the potential to release more heat, so fins may be arranged to increase the thermal performance. Similarly, the spacing of the fins also affects the cooling rates. Increasing the spacing prevents air from getting trapped between fins, which can reduce the efficiency of the heat sink’s cooling performance.

Conclusion

The ATS-12C-121-C2-R0 is a thermal heat sink designed to reduce the temperature of various electronic components. It works by transferring heat from the component to the fins, which release the heat to the surrounding environment. The resulting decrease in temperature allows the device or component to remain within safe operating temperatures. The fin material, thickness, and spacing are all important factors in determining the effectiveness of the thermal solution. With its high thermal conductivity and efficient fin design, the ATS-12C-121-C2-R0 is an ideal solution for wide range of applications, including server and storage rack mounted devices, telecommunication equipment, high power LED lighting, and automotive applications.

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