ATS-12C-131-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.60°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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IntroductionHeat sinks are devices that are used to cool computer components that generate a lot of heat or dissipation. The ATS-12C-131-C2-R0 is a thermal-heat sink that is widely used in many applications. It has been designed to provide effective, efficient cooling in a variety of scenarios. This article will discuss the applications of the ATS-12C-131-C2-R0 as well as its working principle. ApplicationsThe ATS-12C-131-C2-R0 is widely used in many different types of applications. It is ideal for use in medical devices, industrial instrumentation, and consumer electronics, where it provides effective cooling. In addition, the ATS-12C-131-C2-R0 can also be used in data centers and server racks for cooling high-performance hardware. The ATS-12C-131-C2-R0 is also used in industrial lighting applications, as it is capable of dissipating large amounts of heat with a high degree of efficiency. DesignThe ATS-12C-131-C2-R0 is constructed from aluminum, which allows for a large amount of thermal capacity for efficient heat dissipation. The heat sink is designed with an internal fin structure, which creates a high surface area that allows for efficient heat transfer. The fins can be configured with different heights and angles to optimize the thermal performance. The ATS-12C-131-C2-R0 can also be mounted through a variety of methods, such as screws, rivets, and clamps. Working PrincipleThe ATS-12C-131-C2-R0 works on the principle of thermodynamics. Heat is transferred from a warmer component or environment to the cooler heat sink via conduction or convection. The internal fin structure increases the surface area of the heat sink, which allows for more efficient heat transfer. The fins are also designed with angles and heights that promote efficient airflow, which helps to dissipate the heat. The heat is dissipated to the surrounding environment or to an internal cooling system. ConclusionThe ATS-12C-131-C2-R0 is a thermal-heat sink that is widely used in medical devices, industrial instrumentation, consumer electronics, data centers, server racks, and industrial lighting applications. It has been designed with an internal fin structure and is constructed from aluminum for efficient heat transfer. The ATS-12C-131-C2-R0 works on the principle of thermodynamics, transferring heat from a warmer component or environment to a cooler sink via conduction or convection, and dissipates the heat to the environment or to an internal cooling system.

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