| Allicdata Part #: | ATS-12C-14-C1-R0-ND |
| Manufacturer Part#: |
ATS-12C-14-C1-R0 |
| Price: | $ 3.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12C-14-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.34026 |
| 30 +: | $ 3.25017 |
| 50 +: | $ 3.06974 |
| 100 +: | $ 2.88912 |
| 250 +: | $ 2.70857 |
| 500 +: | $ 2.61828 |
| 1000 +: | $ 2.34741 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.96°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are devices used to dissipate heat from electronic components. ATS-12C-14-C1-R0 is a heat sink designed for thermal management and thermal dissipation of electronic components.
ATS-12C-14-C1-R0 Heat Sink Application Field
ATS-12C-14-C1-R0 is a compact, low profile extruded heat sink that is designed to dissipate heat efficiently from the components in various electronic and industrial applications. It is designed for cooling high power surface mount devices, high frequency circuits, LED lighting, amplifiers, high power modules, and other applications. It is an ideal solution for applications with limited space or high-density requirements.
The ATS-12C-14-C1-R0 can dissipate up to 140W of power and also features a low profile design. This heat sink has been designed to dissipate heat from various components and electronic systems in a variety of applications including power supplies, telecommunications, automotive electronics systems, computer peripherals, handheld devices, industrial equipment, and medical equipment.
ATS-12C-14-C1-R0 Working Principle
The ATS-12C-14-C1-R0 heat sink works by dissipating heat from the component or device that is being cooled. The heat sink is attached to the component, and is typically in direct contact with it. As the component becomes hot, the heat is dissipated from the component to the surrounding environment.
The ATS-12C-14-C1-R0 heat sink features multiple fins that serve as heat conductors. The fins are designed to provide maximum airflow to the dissipated heat, which helps to ensure that the component is efficiently cooled. Additionally, the fins are designed so that heat is transferred away from the component quickly and effectively.
The ATS-12C-14-C1-R0 heat sink also features a high-efficiency, low-noise fan that pulls air over the fins and helps to keep the component cool. The fan is designed to be as efficient as possible, and to operate without creating any additional noise, making the ATS-12C-14-C1-R0 a great choice for applications in which noise is a concern.
Conclusion
The ATS-12C-14-C1-R0 is a compact, low-profile heat sink designed for thermal management and thermal dissipation of components in various electronic and industrial applications. It is an ideal solution for applications with limited space or high-density requirements. The heat sink features multiple fins and a high-efficiency, low-noise fan for efficient and quiet heat dissipation.
The specific data is subject to PDF, and the above content is for reference