| Allicdata Part #: | ATS-12C-145-C1-R0-ND |
| Manufacturer Part#: |
ATS-12C-145-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12C-145-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-12C-145-C1-R0 is an advanced thermal heat sink from ATS Technology Solutions. It is designed to optimally dissipate heat energy from electronic components and offers OEM customers a cost-effective, safe, efficient and reliable solution for their product needs. The ATS-12C-145-C1-R0 offers improved cooling performance compared to conventional aluminum, copper and other metal solutions.
Application Field of ATS-12C-145-C1-R0
The ATS-12C-145-C1-R0 is designed for applications such as redundant power systems, aerospace electronic assemblies, telecommunications equipment, computers, CPUs and any other system that generates heat needs cooling. The ATS-12C-145-C1-R0 ensures the safety and protection of these components and guarantees the performance of these systems.
Working Principle and Technical Specifications
The ATS-12C-145-C1-R0 is a two-phase direct contact thermoelectric cooling solution. It utilizes a low-friction, self-lubricating nanomaterial which acts as a heat bridge between the heat source and the heat sink in order to enable efficient heat transfer without the need for external fans or pumps. The device features high-thermal conductivity and a high thermal capacity, allowing for fast and efficient heat transfer. The ATS-12C-145-C1-R0 also features low-pressure drop characteristics, allowing it to operate smoothly and without noise.
The ATS-12C-145-C1-R0 includes a specially designed plate design and a high-quality aluminum alloy housing. This aluminum-alloy housing is anodized to provide superior resistance to corrosion and damage. The plate design includes grooves and staggered height cooling fins that improve air flow and better dissipate heat. The ATS-12C-145-C1-R0 is able to maintain temperatures of up to 150°C and can handle up to 500 Watts of heat load.
Benefits of ATS-12C-145-C1-R0
The ATS-12C-145-C1-R0 is a cost-effective solution for keeping electronic components cool and protecting them from overheating. It provides improved cooling performance compared to traditional aluminum, copper and other metal solutions. It features a robust and reliable design and is designed for optimized thermal performance. The ATS-12C-145-C1-R0 also offers improved system reliability, making it ideal for high-performance applications.
The ATS-12C-145-C1-R0 is a simple-to-use and easy-to-install solution. It requires minimal setup and maintenance, making it ideal for OEM customers. The device is designed to be used in any system, meaning that it can easily be integrated into existing systems. This ensures maximum performance and reliability.
Overall, the ATS-12C-145-C1-R0 is an advanced thermal heat sink with excellent performance and reliability. It is designed to provide efficient and reliable cooling for all electronic components, offering OEM customers a cost-effective and safe solution for their product needs.
The specific data is subject to PDF, and the above content is for reference