| Allicdata Part #: | ATS-12C-162-C1-R0-ND |
| Manufacturer Part#: |
ATS-12C-162-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12C-162-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become an essential component of modern electronic devices, and thermal heat sinks are an important component of many designs. The ATS-12C-162-C1-R0 is an industrial-grade, high-performance heat sink designed to provide reliable thermal management solutions, even under the most extreme thermal and environmental conditions.
The ATS-12C-162-C1-R0 features a one-piece, extruded aluminum construction that provides superior heat-dissipation capacity. The anodized finish ensures that it will remain corrosion-resistant and durable, even in the harshest environments. Its design also allows it to be easily installed into a variety of electronics, including switches, motors, and even soldering irons.
In addition to providing high thermal efficiency, the ATS-12C-162-C1-R0 is also designed to provide efficient air cooling. The heat sink features a large-diameter, open channel design that is designed to optimize airflow and reduce thermal resistance. This allows for improved cooling performance and more efficient airflow.
The ATS-12C-162-C1-R0 is well-suited for use in both commercial and industrial settings. Its rugged construction ensures that it can handle the high temperatures, vibration, and shock that are common in these environments. The heat sink is also well-suited for use in high-power electronics that require clean and efficient cooling.
The ATS-12C-162-C1-R0 is designed to be used in conjunction with fan-cooled heatsinks, such as those found in servers and high-powered PCs. The heat sink can be used to dissipate heat generated by these components, and its design ensures it can do so rapidly and efficiently. This helps to reduce the risk of system failure due to overheating and extends the life of the components.
The working principle of the ATS-12C-162-C1-R0 is simple. When in use, air is drawn in through the large-diameter, open channel to cool and quickly dissipate the heat generated by the components. This cooling air is then released through vents, thus allowing the device to remain cool and functioning at its peak performance level.
The ATS-12C-162-C1-R0 is an excellent choice for any application in which reliable, efficient, and long-lasting thermal management solutions are required. It is well-suited for use in commercial and industrial settings where rugged construction and efficient cooling are needed. The heat sink is also suitable for use in high-powered electronics, as well as in servers and high-powered PCs.
The specific data is subject to PDF, and the above content is for reference