ATS-12C-164-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-12C-164-C1-R0-ND

Manufacturer Part#:

ATS-12C-164-C1-R0

Price: $ 3.99
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X35MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12C-164-C1-R0 datasheetATS-12C-164-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.62061
30 +: $ 3.41922
50 +: $ 3.21817
100 +: $ 3.01701
250 +: $ 2.81588
500 +: $ 2.61474
1000 +: $ 2.56446
Stock 1000Can Ship Immediately
$ 3.99
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.39°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Heat sinks are used in a variety of applications to dissipate thermal energy created by an operating system. They are typically used to prevent overheating of components and performance degradation, and can be found in computers, electronic components, home appliances, and other heavy-duty machinery. The ATS-12C-164-C1-R0 is a type of heat sink specifically designed for use in applications requiring high levels of thermal performance.

The ATS-12C-164-C1-R0 is a versatile and efficient heat sink designed for high thermal performance applications. It is made from a combination of aluminum and copper alloy, and has an integrated two-piece design for improved heat dissipation. The integrated design also allows for easy installation and use. It also has a large size and surface area, which provides a greater amount of thermal energy dissipation, allowing it to perform efficiently even under higher loads.

The primary working principle of the ATS-12C-164-C1-R0 is to dissipate thermal energy from the operating system. This is done through the use of three cooling channels, which are designed to take in heat from the operating system and move it away from components that could overheat. The heat is then transferred to the heat sinks fins and radiates out into the environment. This ensures that the components do not become too hot and that the operating system stays running at its optimum performance.

The ATS-12C-164-C1-R0 is an effective and efficient solution for any application requiring high performance thermal dissipation. It provides excellent cooling power even at higher loads, and is easy to install and use. Its large surface area ensures maximum efficiency, and its aluminum and copper alloy construction makes it durable and long lasting. The three cooling channels ensure efficient thermal transfer, and the integrated design make it easy to install and maintain over time.

The ATS-12C-164-C1-R0 heat sink is an ideal solution for any application requiring high performance thermal dissipation. It is designed for easy installation and use and provides an efficient and effective way to dissipate thermal energy from the operating system. Its large surface area and integrated design make it an excellent choice for any application requiring thermal performance. Its aluminum and copper alloy construction make it durable and long lasting, and the three cooling channels make it an excellent choice for high performance thermal dissipation.

The specific data is subject to PDF, and the above content is for reference

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