| Allicdata Part #: | ATS-12C-165-C3-R0-ND |
| Manufacturer Part#: |
ATS-12C-165-C3-R0 |
| Price: | $ 3.20 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12C-165-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.91249 |
| 30 +: | $ 2.83395 |
| 50 +: | $ 2.67649 |
| 100 +: | $ 2.51899 |
| 250 +: | $ 2.36157 |
| 500 +: | $ 2.28284 |
| 1000 +: | $ 2.04668 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.63°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are essential components in many industrial applications. The ATS-12C-165-C3-R0 is a high-performance thermal heat sink designed for applications such as high-speed motor control, automotive electronics, solar panel controllers, active noise reduction, and power electronics. It helps improve the thermal efficiency of the system by dissipating the heat generated in the system to the ambient air.
The ATS-12C-165-C3-R0 is constructed from pure aluminum, which has excellent electrical insulation, thermal conductivity, and heat dissipation properties. To optimize thermal performance, the fins are designed to maximize air flow contact surface. The heat sink can be mounted onto a flat surface and has the capability to dissipate up to 35 watts of heat. It is designed to be corrosion resistant, lightweight, and durable, with a long life span.
The ATS-12C-165-C3-R0 is comprised of a base plate and a fin stack. The base plate is used to support the fins, which are arranged to allow maximum air exchange to effectively regulate the system temperature. The fins are spaced to create increased contact between the air and the base plate. This can increase the heat transfer rate.
The ATS-12C-165-C3-R0 works by dissipating heat from the active parts of the system, such as CPUs, into the air. The heat is absorbed by the fins, which in turn act as a radiator. The fin stack is designed to allow air to flow freely and uniformly around the heat sink. The air is then able to dissipate the heat out of the system.
The ATS-12C-165-C3-R0 is a reliable and effective thermal heat sink for high-performance applications. It can help reduce system temperatures and improve efficiency, making it ideal for industrial applications where heat dissipation and reliability are highly valued. The ATS-12C-165-C3-R0 is also cost effective, making it ideal for custom designs and projects.
The specific data is subject to PDF, and the above content is for reference