ATS-12C-180-C3-R0

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Thermal management technology is an important field for electronics manufacturers, requiring advanced cooling and temperature control methods for increasingly smaller components. The ATS-12C-180-C3-R0 heat sink module is a thermal solution for cooling and controlling the temperature of electronic components, widely used in consumer electronics and commercial products.The ATS-12C-180-C3-R0 heat sink module is designed to increase the cooling performance of compact components, with a low-profile package that fits tight spaces. A larger number of base plates provides maximum contact area against the component enclosure while still allowing for direct-air cooling. The C-shaped thermal structure with cross buckling allows for low-pressure contact and high material strength, and the smooth surface ensures safe installation.The platform of the ATS-12C-180-C3-R0 heat sink module utilizes a unique thermal structure and powerful fin design for increased cooling capacity. The module also includes a novel heat transfer technology, allowing for more efficient thermal transfer of the heat generated by electronic components to the heat sink. In addition, the thermal structure of the module has been optimized for low acoustic noise and vibration, resulting in a quieter and more efficient thermal solution.The working principle of the ATS-12C-180-C3-R0 heat sink module is simple. Heat is generated by the electronic components mounted to the printed circuit board (PCB) beneath the heat sink. This heat is then absorbed and dissipated through the finned heat sink, which features a stack of aluminum and copper alloys. The heat is then spread throughout the thermal structure of the module, where it is then free to dissipate into the surrounding air.Due to its efficient design and low profile, the ATS-12C-180-C3-R0 heat sink module is used in a wide variety of consumer and commercial applications. Its compact design is ideal for applications where space is limited, such as microelectronics, TVs, cell phones, tablets, and other portable devices. It is also widely used in medical systems, industrial equipment, and military-grade products, as well as automotive and aerospace technology.In summary, the ATS-12C-180-C3-R0 heat sink module is a thermal solution for cooling and controlling the temperature of electronic components. Its novel thermal structure and powerful fin design provide enhanced cooling performance, higher material strength, and low acoustic noise and vibration. This powerful and efficient module is used in a variety of consumer and commercial applications, making it the perfect thermal solution for any application.

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