
Allicdata Part #: | ATS20581-ND |
Manufacturer Part#: |
ATS-12C-200-C2-R0 |
Price: | $ 3.93 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 50X50X10MM XCUT T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 3.56580 |
10 +: | $ 3.47004 |
25 +: | $ 3.27726 |
50 +: | $ 3.08448 |
100 +: | $ 2.89170 |
250 +: | $ 2.69892 |
500 +: | $ 2.50614 |
1000 +: | $ 2.45794 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.969" (50.00mm) |
Width: | 1.969" (50.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 9.78°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-12C-200-C2-R0 thermal – heat sink is mainly used for controlling the temperature of electrical components as well as cooling. It has become increasingly important in the field of many industries and applications due to its reliable and stable performance. It also boasts a large heat dissipating area. The design of a typical thermal hand consumer makes it an optimal solution for these various applications. This article will provide an insight into the application and working principle of the ATS-12C-200-C2-R0 thermal – heat sink.
A thermal – heat sink is essentially a block of metal with fins or protrusions used to dissipate heat away from a device. It is typically made from aluminum, copper, or other metals that boast excellent thermal conductivity. Heat is conducted away from a device by a heat transfer fluid that is drawn away from the heat sink via a fan or other cooling device. The shape of the fins determines how quickly heat is transferred away from the device, and many types of heat sinks offer different levels of heat dissipation.
The ATS-12C-200-C2-R0 thermal – heat sink has been designed as an ideal solution for various electronic thermal management applications. Its integrated cooling fan ensures efficient and uniform heat dissipation, with low noise and high airflow. Its fins have been designed to extract as much heat from the device as possible. The heat sink is also compatible with various types of ventilation systems, such as vertical and horizontal airflow, to enable optimal cooling.
The ATS-12C-200-C2-R0 thermal – heat sink is mainly used for controlling the temperature of various components. It is used in a wide range of applications, including computers and other devices, semiconductor devices, power supplies and other industrial applications. It is suitable for cooling electronic components where noise levels must be kept low and advanced cooling techniques are needed. It can also be used to cool LED components to ensure efficient and consistent lighting output.
The ATS-12C-200-C2-R0 thermal – heat sink also works in conjunction with other thermal management solutions to ensure optimal cooling of electronic devices. This may include heat spreaders, heat exchangers, cooling fans, as well as various types of thermostats. To increase the efficiency of the heat sink, all components must be installed correctly and the heat dissipating material must be kept clean at all times.
In summary, the ATS-12C-200-C2-R0 thermal – heat sink is a reliable and efficient thermal management solution that can be used in a wide range of applications. It has been designed as an ideal solution for controlling the temperature of various components, and its integrated cooling fan ensures efficient and uniform heat dissipation. It is suitable for cooling electronic components where noise levels must be kept low and advanced cooling techniques are needed. Furthermore, it works in conjunction with other thermal management solutions to ensure optimal cooling of electronic devices.
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