| Allicdata Part #: | ATS-12C-23-C3-R0-ND |
| Manufacturer Part#: |
ATS-12C-23-C3-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12C-23-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-12C-23-C3-R0 is a highly advanced thermal heat sink from the world-renowned manufacturer of cooling solutions, Alpha Thermal Sensors. With the help of a highly effective combination of natural convection and conductive cooling, it can effectively accelerate the transfer of heat away from vital components of electrical, telecommunications, computer, and other high-tech systems. This article will discuss the application fields and the principles of operation of the ATS-12C-23-C3-R0.
Applications of ATS-12C-23-C3-R0
Heat sinks are widely used in a variety of applications and can be found in both consumer and commercial products. The ATS-12C-23-C3-R0 is an ideal solution for applications in which fast and efficient heat transfer is needed. These include, but are not limited to, the following areas:
- Data centers
- Computer clusters
- High performance computing
- Power supply systems
- Telecommunications networks
- Industrial automation
- Wireless and satellite communications
The ATS-12C-23-C3-R0 is an ideal choice for these applications because of its high power density, which enables it to handle larger amounts of heat generated in rapidly changing conditions. Furthermore, its compact size and low weight make it well suited for use in tight spaces.
Working Principle
The ATS-12C-23-C3-R0 is designed to transfer heat efficiently through two distinct cooling methods: natural convection and conductive cooling. In both cases, the heat flows from the hotter area (the processor, in this case) to the cooler area (the heat sink).
For natural convection, the heat is transferred through the movement of air. As the heated air around the heat sink is replaced by cooler air, the heat sink absorbs this heat. The heat then escapes into the cooler environment through the fin system of the heat sink. The ATS-12C-23-C3-R0 features an integrated fan that helps to create the necessary air flow for natural convection to take place.
Conductive cooling, the second method of heat transfer used by the ATS-12C-23-C3-R0, works by direct contact between the heat sink and the components. In this case, the heat is transferred through a metallic base plate, which thermally couples the heat sink to the processor. The ATS-12C-23-C3-R0 features a double thickness copper base plate for maximum efficiency.
Conclusion
The ATS-12C-23-C3-R0 is a highly advanced thermal heat sink solution from Alpha Thermal Sensors, and can be effectively used in a variety of applications. Its combination of natural convection and conductive cooling enables it to rapidly and efficiently dissipate heat away from the components. This makes it an ideal solution for a variety of scenarios, including data centers, computer clusters, telecommunications networks, and more.
The specific data is subject to PDF, and the above content is for reference