| Allicdata Part #: | ATS20598-ND |
| Manufacturer Part#: |
ATS-12C-27-C2-R0 |
| Price: | $ 7.71 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12C-27-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.94260 |
| 10 +: | $ 6.75486 |
| 25 +: | $ 6.37963 |
| 50 +: | $ 6.00440 |
| 100 +: | $ 5.62918 |
| 250 +: | $ 5.25390 |
| 500 +: | $ 4.87862 |
| 1000 +: | $ 4.78480 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronic components is essential to preserve mechanical integrity and to avoid system failure. Heat sinks are used to move, dissipate, or store heat away from critical components. The ATS-12C-27-C2-R0 is a high-performance heat sink designed for a number of applications. This article will discuss the application fields and working principles of the ATS-12C-27-C2-R0.
The ATS-12C-27-C2-R0 is designed for use on a wide variety of heat generating electronic components, such as microprocessors, power transistors, voltage regulators, and other logic and signal components. It can be used on din Rail systems, PCBs, plastic and aluminum enclosures, and other applications where thermal management is required. The ATS-12C-27-C2-R0 is designed to provide an efficient and reliable thermal solution for a variety of applications. This heat sink features a compact, lightweight design made from aluminum extrusions and anodized anodized alloy for superior performance and durability. It also has a unique, low profile design that allows it to be installed in tight spaces without sacrificing performance.
The ATS-12C-27-C2-R0 employs two different working principles to achieve thermal management: convectional and conductive cooling. Convection cooling moves heated air away from the active component, while conductive cooling uses solid transfer paths to move heat away. The ATS-12C-27-C2-R0 also has a unique, microchanneled design which enhance the efficiency of thermal dissipation. This design creates a greater surface area to maximize heat transfer between the heat sink and the air. The result is an improved heat transfer rate and uniform cooling for the most demanding applications.
The ATS-12C-27-C2-R0 can be used in a variety of applications, including many industrial environments where thermal management is essential. It is highly resistant to corrosion and heat, and can be used in high-temperature applications up to 100°C. Other features include a wide operating margin and high efficiency so it can be used in many demanding applications. It is also highly resilient to dust, dirt, and moisture and its aluminum extrusion construction provides a reliable and secure installation.
The ATS-12C-27-C2-R0 is an ideal choice for a variety of applications. It provides superior thermal management and can be used in a variety of challenging environments. Its aluminum extrusion construction ensures a secure and reliable installation, and its microchanneled design maximizes thermal dissipation for improved performance. With its wide operating margin and high efficiency, the ATS-12C-27-C2-R0 can be an excellent choice for many industrial applications requiring reliable thermal management.
The specific data is subject to PDF, and the above content is for reference