ATS-12C-53-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.76°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Application Field & Working Principle of ATS-12C-53-C3-R0

Introduction

The ATS-12C-53-C3-R0 thermal-heat sinks technology used for cooling electronic components and systems is gaining more and more attention due to its remarkable cooling performance and high efficiency. This article will discuss the application fields and working principle of the ATS-12C-53-C3-R0 thermal-heat sinks.

Application Fields

The ATS-12C-53-C3-R0 thermal-heat sink technology is widely used in a variety of electronic components and systems, such as computer CPUs, GPUs, hard drives, computer motherboards, high-power amplifiers, video cards, and a range of other electronic components. The thermal-heat sink technology allows for effective cooling of these components or systems.The ATS-12C-53-C3-R0 thermal-heat sinks have also found application in industries as diverse as aerospace, automotive, and medical equipment. In these sectors, the ATS-12C-53-C3-R0 thermal-heat sinks are used to cope with high-temperature environments and to ensure high performance and reliability.

Working Principle

The basic principle underlying the ATS-12C-53-C3-R0 thermal-heat sink technology is the use of aluminum fins to dissipate heat. The fins are designed to absorb heat from the electronic components and then transfer the heat to the surrounding environment by convection. The aluminum fins are arranged in a way that increases the surface area exposed to the air and allows for maximum convection. In addition, the fins also utilize anEnclosed Heat Transfer(EHT) system. This system consists of a base plate and sealed cover plate assembly, which allows air to pass through and circulate over the aluminum fins, thereby enhancing the cooling performance.The ATS-12C-53-C3-R0 thermal-heat sinks come in different shapes and sizes to meet the different application needs of different components or systems. For example, if the application needs a heat sink with a large surface area to dissipate heat, a larger heat sink base and fins would be used. Conversely, if the application needs a heat sink with a smaller surface area, a smaller heat sink base and fins would be used.

Conclusion

The ATS-12C-53-C3-R0 thermal-heat sinks provide an efficient cooling solution for a variety of electronic components and systems. The fins are capable of effectively dissipating heat from the electronic components and then transferring the heat to the surrounding environment by convection. The technology also comes in different shapes and sizes to meet the specific application needs of different components or systems.

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