| Allicdata Part #: | ATS-12C-60-C1-R0-ND |
| Manufacturer Part#: |
ATS-12C-60-C1-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12C-60-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal or heat sink is a device used to reduce the temperature of a component or system. It is typically a metal block with fins that uses convection to draw heat away from the object being cooled and dissipate it into the surrounding air. Heat sinks are most commonly used to cool components such as CPUs, GPUs, and other microelectronics, as well as hot areas on a PCB.
The ATS-12C-60-C1-R0 heatsink is a compact-sized, cost-effective solution for a variety of applications that require heat dissipation, such as gaming PCs, industrial machines, and automotive electronics. It is designed with a copper base and aluminum fins for maximum heat dissipation to keep components cool during operation.
The ATS-12C-60-C1-R0 is manufactured with anodized aluminum fins and copper heat-pipe technology that efficiently transfers heat away from the components. The fins in this heatsink also promote effective heat dissipation from the heat-pipe core, while the aluminum alloy protective coating enhances durability. Additionally, the fins are strategically designed to provide maximum cooling performance.
This heat sink uses a combination of air flow and heat conduction to reduce temperature. The airflow allows heat to escape the system, while the heat conduction transfers heat from the component to the heatsink via metal components. Heat is also dissipated away faster by the heatsink\'s air-flow system, thanks to its optimized design of the fins and the surrounding air passages.
The ATS-12C-60-C1-R0 is compatible with a variety of components, including processors, chipsets, memory, and high-powered graphics cards. It can be used in industrial PC applications, as well as in gaming PC setups. Additionally, this heat sink is compatible with both Intel and AMD Ryzen CPU socket types, making it a versatile choice.
In conclusion, the ATS-12C-60-C1-R0 is an efficient and cost-effective thermal solution for a variety of applications. It is designed to effectively transfer heat away from components and dissipate it into the surrounding air, providing a reliable cooling system. The strategic design of the fins and airflow system ensure maximum cooling performance, and its compatibility with Intel and AMD Ryzen sockets makes this heat sink a great choice for any application.
The specific data is subject to PDF, and the above content is for reference