| Allicdata Part #: | ATS-12C-62-C3-R0-ND |
| Manufacturer Part#: |
ATS-12C-62-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12C-62-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.58°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-12C-62-C3-R0 thermal heat sink is widely used in a wide range of thermal management applications. This particular thermal heat sink boasts a number of impressive design features, such as a slim streamline profile, fin shape design, and full metal construction for maximum heat dissipation. Not only is it cost-effective, but it also enjoys an impressive thermal performance.
The ATS-12C-62-C3-R0 thermal heat sink is a device designed to dissipate heat in order to keep components or devices from overheating. It functions as a bridge between the components and the air, creating a thin layer of air between the components and the heat sink. The heat sink then dissipates the heat generated by the components into the surrounding air. This helps to keep components at a safe operating temperature.
The ATS-12C-62-C3-R0 thermal heat sink is made of a full metal construction that utilizes several fin-shape designs to maximize its ability to dissipate heat efficiently. The slim profile and the fin-shape design of the heat sink allow air to move freely around it, ensuring that even when the components are emitting a large amount of heat, the heat sink will be able to draw it away quickly and efficiently. The design of the ATS-12C-62-C3-R0 thermal heat sink also helps to reduce noise by absorbing vibration.
The ATS-12C-62-C3-R0 thermal heat sink can be used in any type of electronic circuit, whether it is industrial, telecommunications, automotive, or consumer use. It is a reliable solution that can help to extend the life of the components in the circuit. It is especially useful in applications where a high amount of heat is generated, such as in LED lighting and power supplies. The ATS-12C-62-C3-R0 thermal heat sink can help to dissipate the heat generated from the components, helping to keep them at a safe temperature, while at the same time improving the overall performance of the system.
The ATS-12C-62-C3-R0 thermal heat sink is an ideal solution for thermal management applications. It is highly efficient, cost-effective, and offers impressive performance, making it an ideal solution for any application that needs to dissipate heat quickly and effectively. Whether it is a consumer electronics device, an industrial system, an automotive circuit, or any other type of electronic circuit, the ATS-12C-62-C3-R0 thermal heat sink is an excellent choice.
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