ATS-12C-76-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	11.84°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-12C-76-C3-R0

The ATS-12C-76-C3-R0 is a specialty heat-sink designed for use in aeronautic, automotive, industrial and military applications. As a premium heat-sink, it offers high thermal performance with minimal space requirements, making it ideal for projects that require exceptional performance and reliability.

Design and Construction

The ATS-12C-76-C3-R0 is constructed using exothermic copper alloy with an enhanced surface finishing process for optimal heat transfer. The optimized Heat Sink area includes 67 cooling fins that are specifically designed to maximize the cooling capacity. To ensure a robust and robust performance, the heat-sink is constructed with an aluminum base and an anodized aluminum cover.

Application Field and Working Principle of ATS-12C-76-C3-R0

The ATS-12C-76-C3-R0 Heat Sink is designed for use with high-power electronics. This includes CPUs, GPUs, FPGAs and other high-end electronics that require intensive cooling. To properly function, it relies on the natural convective process of thermal transfer. This involves the movement of heated air as it rises from the source and is replaced by cooler air. The ATS-12C-76-C3-R0 is designed to efficiently use this convection process to remove heat from the source. Its design optimizes airflow, resulting in maximum cooling of the device. The fins in the heat sink area further increases the cooling efficiency by increasing the surface area exposed to the airflow. Additionally, the anodised aluminum cover ensures that the maximum amount of air is exchanged between the fin area and the environment, further improving performance.

Characteristics and Advantages

The ATS-12C-76-C3-R0 Heat Sink boasts a number of features that make it ideal for a variety of applications. Its low space requirements make it suitable for use in small or crowded environments. The enhanced copper alloy construction not only increases heat transfer, but also improves reliability. Additionally, the aluminum base and cover ensure lasting performance and superior corrosion resistance. The optimized fin geometry also reduces noise and vibrations associated with high-performance cooling. Furthermore, the anodized aluminum cover increases the airflow efficiency and maintains temperatures at a consistent level. This ensures that devices are effectively cooled, even under high load or in high ambient temperatures.

Conclusion

Overall, the ATS-12C-76-C3-R0 heat sink is an excellent choice for cooling high-powered electronics. Its optimized design ensures efficient cooling with minimal space requirements. This combination of features makes it ideal for industrial, automotive, aeronautical, and military applications where performance and reliability are essential.

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