| Allicdata Part #: | ATS20645-ND |
| Manufacturer Part#: |
ATS-12C-86-C2-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12C-86-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.56580 |
| 10 +: | $ 3.47004 |
| 25 +: | $ 3.27726 |
| 50 +: | $ 3.08448 |
| 100 +: | $ 2.89170 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.50614 |
| 1000 +: | $ 2.45794 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-12C-86-C2-R0 application field and working principle
Thermal - Heat Sinks is a type of device used to dissipate thermal energy from a hot object, such as a component of an electronic system, to another cooler object. ATS-12C-86-C2-R0 is a type of heat sink device, used for high power dissipation applications. It is designed to be mounted on a printed circuit board, with a maximum power rating of twelve watts.
This device is manufactured with a dieCast aluminum material, which is lightweight yet very effective in thermal energy dissipation. The primary purpose of the device is to protect the components of the circuit board from heat damage caused by the high power dissipation. It features an enhanced heat sink design which increases its thermal dissipation capability. The device is equipped with a smooth-walled base which helps to reduce air turbulence and noise level. Additionally, the device has a low profile design which enables efficient space utilization within the cabinet.
The ATS-12C-86-C2-R0 works by transferring thermal energy from the hot components on the circuit board to the cooler surface of the heat sink. This thermal transfer is accomplished by utilizing the natural air convection. The heat energy is taken away from the component and passed through the heat sink fins, which then dissipate the heat energy into the air. As the air temperature around the device is increased, the air convection inside the heat sink fins also increases, leading to an increased heat dissipation rate. Consequently, the temperature of the components is kept at a safe level.
The device is equipped with an additional air flow chamber, which helps to further increase the air convection within the heat sink. The air flow chamber works by creating a vacuum seal, which more efficiently pulls in the cool air from the outside environment. This increases the air convection rate, leading to an improvement in the thermal efficiency of the ATS-12C-86-C2-R0.
The ATS-12C-86-C2-R0 is a highly efficient heat sink device, making it ideal for use in high power dissipation applications. Its lightweight aluminum construction and improved air convection make it suitable for enclosed systems, including laptops, servers and other electronic systems. In addition, its low profile design makes it suitable for system cabinets with limited mounting space.
The ATS-12C-86-C2-R0 is a reliable and efficient device, suitable for a variety of thermal control applications. Its lightweight construction and improved air circulation make it perfect for a wide range of applications, making it an ideal choice for a thermal control solution. With its enhanced heat dissipation capabilities, the ATS-12C-86-C2-R0 can help to ensure efficient and safe thermal operation, even in high power dissipating applications.
The specific data is subject to PDF, and the above content is for reference