| Allicdata Part #: | ATS-12D-09-C3-R0-ND |
| Manufacturer Part#: |
ATS-12D-09-C3-R0 |
| Price: | $ 3.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12D-09-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.47004 |
| 30 +: | $ 3.27726 |
| 50 +: | $ 3.08448 |
| 100 +: | $ 2.89170 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.50614 |
| 1000 +: | $ 2.45794 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
ATS-12D-09-C3-R0 application field and working principle
ATS-12D-09-C3-R0 is a type of Heat Sink, which is designed for high density surface mount applications in general. It is constructed of aluminum base with metal topside clip retention to secure the component. The fins have a height of 12 mm, width of 9mm and a thickness of 3mm. It is rugged and reliable, providing excellent thermal performance.
Heat sinks are thermal devices, which are used to transfer heat from a heat source to air or a liquid medium. They are usually made of aluminum, copper or other thermally conductive materials. They are designed with many metal fins or other shapes that increase the total surface area for better heat dissipation. Heat Sinks are a commonly used device in the electronics and computing industries to dissipate heat which is generated by various components of systems. Heat sinks are also used to prevent overheating of components, thereby increasing the overall system performance and reliability.
The main task of the ATS-12D-09-C3-R0 heat sink is to take heat away from the source and dissipate it so that the source does not overheat. In many cases, a heat sink is used in conjunction with a fan or other type of forced air cooling, to help the heat sink dissipate the heat more quickly. Depending on the application, the heat sink might simply be placed on top of the source, or a separate fan might be used to provide additional cooling. Heat sinking works by transferring heat away from the source by using multiple materials with differing coefficients of thermal conductivity.
The ATS-12D-09-C3-R0 heat sink has an open structure design that optimizes the air circulation in the heatsink, which helps the heat sink dissipate heat more rapidly. The fins are designed to increase heat dissipation are also designed to optimize air flow, allowing the heatsink to maintain a lower temperature. The open structure design also has less weight and will take up less space in an electronic component.
The ATS-12D-09-C3-R0 heat sink is suitable for high density surface mount applications, as it is rugged and reliable, and provides excellent thermal performance. It is the perfect solution for thermal management of components that require high power dissipation, such as CPUs, GPUs, etc.
The specific data is subject to PDF, and the above content is for reference