ATS-12D-10-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-12D-10-C3-R0-ND

Manufacturer Part#:

ATS-12D-10-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12D-10-C3-R0 datasheetATS-12D-10-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are essential components in the modern electronic world, and the ATS-12D-10-C3-R0 is no exception. The ATS-12D-10-C3-R0 is a heavy duty heat sink that is specifically designed for high power applications. The ATS-12D-10-C3-R0 is a thick wall, double screw heat sink that provides superior heat dissipation in a wide range of applications.

The ATS-12D-10-C3-R0 is made from high grade aluminum alloy casting and features a thick wall construction to ensure enhanced resistance to heat. The sink is designed to be capable of dissipating up to 1000 watts of heat energy, and features a large surface area to maximize the thermal transfer for effective cooling. The double screw design securely anchors the heat sink to the device for reliable heat transfer and maximum stability.

The ATS-12D-10-C3-R0 is ideal for use in a wide variety of industrial applications, such as HVAC systems, actuator applications, motors, and other high power systems. The ATS-12D-10-C3-R0 is also ideal for use in high-end electronics such as amplifiers and other power systems. The double screw design ensures a secure attachment to the device and ensures a reliable connection for optimal thermal transfer.

The ATS-12D-10-C3-R0 is a significant advancement in heat sink technology and is designed to provide the highest level of heat dissipation. The thick wall construction allows for optimal thermal transfer from the device to the environment and provides maximum stability. The double screw design ensures a secure attachment and reliable heat transfer from the device to the environment. The large surface area of the sink provides faster cooling, reduces temperature fluctuations, and improves the reliability of the device. The ATS-12D-10-C3-R0 is ideal for a variety of industrial and high-end electronic applications.

The ATS-12D-10-C3-R0 is a great choice when it comes to thermal management solutions. The robust construction ensures optimal thermal transfer and maximum stability. The double screw design ensures a secure attachment to the device and ensures reliable heat transfer from the device to the environment. The large surface area of the sink provides improved cooling and reduces temperature fluctuations. The ATS-12D-10-C3-R0 is ideal for industrial and high-end electronics applications, where it can provide superior thermal management.

The specific data is subject to PDF, and the above content is for reference

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