| Allicdata Part #: | ATS-12D-11-C1-R0-ND |
| Manufacturer Part#: |
ATS-12D-11-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-12D-11-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.06684 |
| 30 +: | $ 2.98431 |
| 50 +: | $ 2.81849 |
| 100 +: | $ 2.65268 |
| 250 +: | $ 2.48686 |
| 500 +: | $ 2.40397 |
| 1000 +: | $ 2.15528 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management devices are used to control and regulate the heat being produced and dissipated in many electronic systems. The ATS-12D-11-C1-R0 is a thermal-heat sink used for cooling and regulating high-power components in industrial applications. This article will discuss the application field and working principle of the ATS-12D-11-C1-R0.
Application Field
The ATS-12D-11-C-R0 is a high efficiency heat sink designed for use with power transistors in a range of applications. It is suited to high-powered components running on 12V to 24V DC, up to 75 Watts, and can handle large currents of up to 6 Amps. This heatsink offers dynamic heat sink performance with low thermal resistance for consistent heat dissipation. The ATS-12D-11-C1-R0 is most often used in medical devices, power supplies, communication systems, automotive systems, motor controls and home entertainment equipment.
Working Principle
The ATS-12D-11-C1-R0 is a heat sink designed to wick some of the heat away from high-powered components, such as the transistors used in power supplies, and thus keeping them cooler and prolonging their life. The two main features of the ATS-12D-11-C1-R0 are its copper base and extruded aluminum fins. The copper has a good thermal conductivity, meaning that the heat is quickly transferred away from the hot device. The extruded aluminum fins work as cooling fins, as the heat is spread across the entire component surface area creating more surface area for dissipation. The aluminum fins aid the dissipation of the heat into the surrounding environment, resulting in the component\'s temperature being lowered and optimized.
In order to reduce the thermal resistance as much as possible, the ATS-12D-11-C1-R0 must be tightly coupled to the components it is cooling. This is achieved by connecting the mounting tabs on the heat sink directly to the components\' mounting points. This ensures that maximum heat dissipation is achieved, and the component is as cool as possible. Additionally, the use of thermal grease between the two surfaces can further decrease the thermal resistance and make the heat transfer even more efficient.
Conclusion
The ATS-12D-11-C1-R0 thermal-heat sink is a highly efficient device designed to dissipate heat away from high power components. It has a copper base and extruded aluminum fins for optimal heat dissipation, and is designed to work at 12-24V DC with up to 75 watts of power. Using this thermal device helps to keep high power components cool, preventing potential damage and extending their life. Overall, the ATS-12D-11-C1-R0 is an essential tool for thermal management and cooling in industrial applications.
The specific data is subject to PDF, and the above content is for reference