ATS-12D-131-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS20703-ND

Manufacturer Part#:

ATS-12D-131-C2-R0

Price: $ 5.56
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X20MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-12D-131-C2-R0 datasheetATS-12D-131-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 5.05260
10 +: $ 4.91589
25 +: $ 4.64285
50 +: $ 4.36968
100 +: $ 4.09658
250 +: $ 3.82347
500 +: $ 3.55036
1000 +: $ 3.48209
Stock 1000Can Ship Immediately
$ 5.56
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.60°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Introduction

ATS-12D-131-C2-R0 is a thermal heat sink, also known as a heat spreader. Since its introduction in the late 20th century, this product has been widely used as an effective means for dissipating heat generated by various electrical and electronic components while also protecting them from degradation and failure due to overheating. It is a heatsink that is capable of absorbing lower wattage components, such as LEDs, and can also be used with a fan to more efficiently cool higher wattage hardware components. This article will provide an overview of the application field and working principle of ATS-12D-131-C2-R0 heat sinks.

Application Field of ATS-12D-131-C2-R0 Heat Sinks

 ATS-12D-131-C2-R0 heat sinks are mainly used to cool various electrical and electronic components, including LEDs, transistors, integrated circuits, and other high-powered components. This is achieved by using the ATS-12D-131-C2-R0 heatsink’s thermal properties to draw heat away from the components. This allows the components to operate at cooler temperatures, thereby preventing them from becoming too hot and having their performance affected.

This type of heat sink is commonly used in many types of computer and communications equipment, such as personal computers (PCs), servers, laptops, tablets, and smartphones. It is also used in automotive applications, including navigation systems, infotainment systems, lighting systems, and other onboard electronics. ATS-12D-131-C2-R0 heat sinks have also been used in medical equipment and military applications.

Working Principle of ATS-12D-131-C2-R0 Heat Sinks

The working principle of ATS-12D-131-C2-R0 heat sinks is based on the physical phenomenon of thermodynamics. In thermodynamics, heat is the transfer of energy between two objects with different temperatures. ATS-12D-131-C2-R0 heat sinks use this principle to absorb heat generated by electrical and electronic components and transfer it from the component to a much larger surface area where it can dissipate into the surrounding environment.

This is achieved by the heat sink having a high thermal conductivity and a large surface area that allows it to quickly and effectively absorb heat. The fins and surface of the ATS-12D-131-C2-R0 heat sink also aid in dissipating the heat away by releasing it into the surrounding environment. Additionally, some models of the ATS-12D-131-C2-R0 heatsink can be used in conjunction with a cooling fan to more quickly transfer the heat away from the components.

Conclusion

In conclusion, ATS-12D-131-C2-R0 heat sinks are a versatile thermal solution that can be used to effectively cool various electrical and electronic components. This is achieved by transferring heat away from the components and out into the surrounding environment. ATS-12D-131-C2-R0 heat sinks have a wide range of applications, and can be used in computers, automotive systems, medical equipment, and military applications. Their versatility and effectiveness make them a popular choice for many different thermal solutions.

The specific data is subject to PDF, and the above content is for reference

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